Ag3Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)
Published in Journal of materials research (01.11.2002)
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Journal Article
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
Kang, Sung K., Shih, Da-Yuan, Donald, NY, Henderson, W., Gosselin, Timothy, Sarkhel, Amit, Charles Goldsmith, NY, Puttlitz, Karl J., Choi, Won Kyoung
Published in JOM (1989) (01.06.2003)
Published in JOM (1989) (01.06.2003)
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Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
KORHONEN, Tia-Marje K, TURPEINEN, Pekka, LEHMAN, Lawrence P, BOWMAN, Brian, THIEL, George H, PARKES, Raymond C, KORHONEN, Matt A, HENDERSON, Donald W, PUTTLITZ, Karl J
Published in Journal of electronic materials (01.12.2004)
Published in Journal of electronic materials (01.12.2004)
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Conference Proceeding
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Interfacial reaction studies on lead (Pb)-free solder alloys
Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Myung-Jin Yim, Advocate, G.G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T.A., King, D.E., Konrad, J.J., Sarkhel, A., Puttlitz, K.J.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2002)
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The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue
Henderson, Donald W., Woods, James J., Gosselin, Timothy A., Bartelo, Jay, King, David E., Korhonen, T.M., Korhonen, M.A., Lehman, L.P., Cotts, E.J., Kang, Sung K., Lauro, Paul, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.06.2004)
Published in Journal of materials research (01.06.2004)
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Journal Article
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
Kang, S.K., Lauro, P., Da-Yuan Shih, Henderson, D.W., Gosselin, T., Bartelo, J., Cain, S.R., Goldsmith, C., Puttlitz, K.J., Tae-Kyung Hwang
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Impact of the ROHS directive on high-performance electronic systems
Puttlitz, Karl J, Galyon, George T
Published in Journal of materials science. Materials in electronics (01.03.2007)
Published in Journal of materials science. Materials in electronics (01.03.2007)
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Journal Article
Impact of the ROHS Directive on high-performance electronic systems
Puttlitz, Karl J, Galyon, George T
Published in Journal of materials science. Materials in electronics (01.03.2007)
Published in Journal of materials science. Materials in electronics (01.03.2007)
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Impact of the ROHS Directive on high-performance electronic systems. Part II key reliability issues preventing the implementation of lead-free solders: Lead-free electronic solders
PUTTLITZ, Karl J, GALYON, George T
Published in Journal of materials science. Materials in electronics (2007)
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Published in Journal of materials science. Materials in electronics (2007)
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Solder transfer technique for flip chip and electronic assembly applications
Puttlitz, K.J., Lidestri, K.A., Totta, P.A.
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Conference Proceeding
Journal Article
Ag 3 Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys
Henderson, Donald W., Gosselin, Timothy, Sarkhel, Amit, Kang, Sung K., Choi, Won-Kyoung, Shih, Da-Yuan, Goldsmith, Charles, Puttlitz, Karl J.
Published in Journal of materials research (01.11.2002)
Published in Journal of materials research (01.11.2002)
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Journal Article