Understanding the effect of CNT characteristics on the tensile modulus of CNT reinforced polypropylene using finite element analysis
Bhuiyan, Md A., Pucha, Raghuram V., Worthy, Johnny, Karevan, Mehdi, Kalaitzidou, Kyriaki
Published in Computational materials science (01.11.2013)
Published in Computational materials science (01.11.2013)
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Journal Article
Computational homogenization in RVE models with material periodic conditions for CNT polymer composites
Song, Wonsup, Krishnaswamy, Vikram, Pucha, Raghuram V.
Published in Composite structures (01.03.2016)
Published in Composite structures (01.03.2016)
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Journal Article
Defining the lower and upper limit of the effective modulus of CNT/polypropylene composites through integration of modeling and experiments
Bhuiyan, Md. A., Pucha, Raghuram V, Worthy, Johnny, Karevan, Mehdi, Kalaitzidou, Kyriaki
Published in Composite structures (01.01.2013)
Published in Composite structures (01.01.2013)
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Journal Article
Thermomechanical reliability of underfilled BGA packages
Pyland, J., Pucha, R.V., Sitararnan, S.K.
Published in IEEE transactions on electronics packaging manufacturing (01.04.2002)
Published in IEEE transactions on electronics packaging manufacturing (01.04.2002)
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Journal Article
Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging
Kumbhat, N., Raj, P.M., Pucha, R.V., Jui-Yun Tsai, Atmur, S., Bongio, E., Sitaraman, S.K., Tummala, R.R.
Published in IEEE transactions on advanced packaging (01.11.2007)
Published in IEEE transactions on advanced packaging (01.11.2007)
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Journal Article
Next generation of package/board materials technology for ultra-high density wiring and fine-pitch reliable interconnection assembly
Kumbhat, N., Markondeya Raj, P., Pucha, R.V., Sundaram, V., Doraiswami, R., Bhattacharya, S., Hayes, S., Atmur, S., Sitaraman, S.K., Tummala, R.R.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Design, fabrication, and reliability testing of embedded optical interconnects on package
Hegde, S., Pucha, R.V., Guidotti, D., Fuhan Liu, Yin-Jung Chang, Tummala, R., Gee-Kung Chang, Sitaraman, S.K.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Materials, processes and reliability of mixed-signal substrates for SOP technology
Mahalingam, S., Hegde, S., Ahmad, J., Pucha, R.V., Sundaram, V., Fuhan Liu, White, G., Tummala, R., Sitaraman, S.K.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
System-on-a-package (SOP) substrate and module with digital, RF and optical integration
Sundaram, V., Tummala, R., White, G., Lim, K., Lixi Wan, Guidotti, D., Fuhan Liu, Bhattacharya, S., Pulugurtha, R.M., Abothu, I.R., Doraiswami, R., Pucha, R.V., Laskar, J., Tentzeris, M., Chang, G.K., Swaminathan, M.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
A Novel Low CTE, High Stiffness Ceramic Composite Core
Kumbhat, Nitesh, Raj, P Markondeya, Pucha, Raghuram V, Sundaram, Venky
Published in Circuits Assembly (01.01.2007)
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Published in Circuits Assembly (01.01.2007)
Trade Publication Article
Use of Process-oriented Approaches in Content-Intensive Courses: Some Insight in Teaching / Learning of Machine Design
Pucha, Raghuram V, Utschig, Tristan T, Liang, Steven Y
Published in Association for Engineering Education - Engineering Library Division Papers (23.06.2013)
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Published in Association for Engineering Education - Engineering Library Division Papers (23.06.2013)
Conference Proceeding