Package structure and method of fabricating package structure
Wan, Albert, Shih, Chao-Wen, Hwang, Chien-Ling, Pu, Han-Ping, Liu, Chung-Shi
Year of Publication 29.12.2020
Get full text
Year of Publication 29.12.2020
Patent
Semiconductor package, semiconductor device and method for packaging semiconductor device
Wan, Albert, Shih, Chao-Wen, Pu, Han-Ping, Hsu, Sen-Kuei, Pan, Hsin-Yu
Year of Publication 15.12.2020
Get full text
Year of Publication 15.12.2020
Patent
Package structure and method of manufacturing the same
Liu, Ming-Kai, Hsieh, Yu-Sheng, Ko, Ting-Chu, Chiang, Yung-Ping, Huang, Chang-Wen, Pu, Han-Ping
Year of Publication 21.09.2021
Get full text
Year of Publication 21.09.2021
Patent
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
Liu, Ming-Kai, Hsieh, Yu-Sheng, Ko, Ting-Chu, Chiang, Yung-Ping, Huang, Chang-Wen, Huang, Ching-Yu, Pu, Han-Ping
Year of Publication 04.08.2022
Get full text
Year of Publication 04.08.2022
Patent
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
Liu, Ming-Kai, Ko, Ting-Chu, Chuang, Lipu Kris, Pu, Han-Ping, Liu, Chung-Shi, Pan, Hsin-Yu
Year of Publication 01.07.2021
Get full text
Year of Publication 01.07.2021
Patent
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Chen, Chieh-Yen, Hsiao, Min-Chien, Shih, Chao-Wen, Wang, Chuei-Tang, Pu, Han-Ping
Year of Publication 30.07.2020
Get full text
Year of Publication 30.07.2020
Patent
Conductive Traces in Semiconductor Devices and Methods of Forming Same
Yu, Chen-Hua, Shih, Chao-Wen, Pu, Han-Ping, Tsai, Hao-Yi, Hsu, Sen-Kuei, Pan, Hsin-Yu
Year of Publication 17.06.2021
Get full text
Year of Publication 17.06.2021
Patent
Memory device and manufacturing method thereof
Liu, Ming-Kai, Hsieh, Yu-Sheng, Ko, Ting-Chu, Chiang, Yung-Ping, Huang, Chang-Wen, Huang, Ching-Yu, Pu, Han-Ping
Year of Publication 17.05.2022
Get full text
Year of Publication 17.05.2022
Patent
InFOAiP Technology for High Performance and Compact 5G Millimeter Wave System Integration
Chuei-Tang Wang, Tzu-Chun Tang, Chun-Wen Lin, Che-Wei Hsu, Jeng-Shien Hsieh, Chung-Hao Tsai, Kai-Chiang Wu, Han-Ping Pu, Yu, Douglas
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Get full text
Conference Proceeding
SEMICONDUCTOR PACKAGE STRUCTURE
Wu, Kai-Chiang, Lu, Chun-Lin, Shih, Chao-Wen, Chuang, Nan-Chin, Pu, Han-Ping
Year of Publication 16.04.2020
Get full text
Year of Publication 16.04.2020
Patent
Conductive traces in semiconductor devices and methods of forming same
Yu, Chen-Hua, Shih, Chao-Wen, Pu, Han-Ping, Tsai, Hao-Yi, Hsu, Sen-Kuei, Pan, Hsin-Yu
Year of Publication 02.03.2021
Get full text
Year of Publication 02.03.2021
Patent
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING SEMICONDUCTOR DEVICE
Wan, Albert, Shih, Chao-Wen, Pu, Han-Ping, Hsu, Sen-Kuei, Pan, Hsin-Yu
Year of Publication 19.03.2020
Get full text
Year of Publication 19.03.2020
Patent
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
Liu, Ming-Kai, Hsieh, Yu-Sheng, Ko, Ting-Chu, Chiang, Yung-Ping, Huang, Chang-Wen, Huang, Ching-Yu, Pu, Han-Ping
Year of Publication 13.01.2022
Get full text
Year of Publication 13.01.2022
Patent
Mechanisms of forming connectors for package on package
Cheng, Ming-Da, Wu, Kai-Chiang, Chen, Yu-Feng, Pu, Han-Ping, Lin, Chun-Hung
Year of Publication 04.02.2020
Get full text
Year of Publication 04.02.2020
Patent