A breakthrough in power electronics reliability - New die attach and wire bonding materials
Krebs, Thomas, Duch, Susanne, Schmitt, Wolfgang, Kotter, Steffen, Prenosil, Peter, Thomas, Sven
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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