Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
Frank, T., Moreau, S., Chappaz, C., Leduc, P., Arnaud, L., Thuaire, A., Chery, E., Lorut, F., Anghel, L., Poupon, G.
Published in Microelectronics and reliability (01.01.2013)
Published in Microelectronics and reliability (01.01.2013)
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Journal Article
Electrodeposition of Pb-free Sn alloys in pulsed current
Neveu, B., Lallemand, F., Poupon, G., Mekhalif, Z.
Published in Applied surface science (15.03.2006)
Published in Applied surface science (15.03.2006)
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Journal Article
Silicon heat pipes used as thermal spreaders
Gillot, C., Avenas, Y., Cezac, N., Poupon, G., Schaeffer, C., Fournier, E.
Published in IEEE transactions on components and packaging technologies (01.06.2003)
Published in IEEE transactions on components and packaging technologies (01.06.2003)
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Journal Article
Cutting Edge: Lectin-Like Transcript 1 Is a Ligand for the CD161 Receptor
Aldemir, Hatice, Prod'homme, Virginie, Dumaurier, Marie-Jeanne, Retiere, Christelle, Poupon, Gwenola, Cazareth, Julie, Bihl, Franck, Braud, Veronique M
Published in The Journal of immunology (1950) (15.12.2005)
Published in The Journal of immunology (1950) (15.12.2005)
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Journal Article
The influence of Cu content on the corrosion resistance of Co-Fe-Cu magnetic alloys in aqueous environments
Gigandet, M.P., Perrin, F.X., Pagetti, J., Poupon, G.
Published in Materials and corrosion (01.06.2000)
Published in Materials and corrosion (01.06.2000)
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Journal Article
Silicon heat pipes used as thermal spreaders
Gillot, C., Avenas, Y., Cezac, N., Poupon, G., Schaeffer, C., Fournier, E.
Published in ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) (2002)
Published in ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) (2002)
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Conference Proceeding
The effect of food-derived bioactives peptides on myocardial function in swine after detraining, with and without high fat diet
Goanvec, C., Blat, S., Vincent, S., Pichon, L., Poupon, G., Feray, A., Guerrero, F., Mansourati, J.
Published in European heart journal (02.08.2013)
Published in European heart journal (02.08.2013)
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Journal Article
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric : Reliability of Micro-Interconnects in 3D IC Packages
FRANK, T, MOREAU, S, CHAPPAZ, C, LEDUC, P, ARNAUD, L, THUAIRE, A, CHERY, E, LORUT, F, ANGHEL, L, POUPON, G
Published in Microelectronics and reliability (2013)
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Published in Microelectronics and reliability (2013)
Journal Article
System on Wafer: A New Silicon Concept in SiP
Poupon, Gilles, Batude, Perrine, Sillon, Nicolas, Henry, David, Gillot, Charlotte, Mathewson, Alan, Di Cioccio, Lea, Charlet, Barbara, Leduc, Patrick, Vinet, Maud
Published in Proceedings of the IEEE (01.01.2009)
Published in Proceedings of the IEEE (01.01.2009)
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Journal Article
Future challenges and opportunities for heterogeneous process technology. Towards the thin films, Zero Intrinsic Variability devices, Zero Power era
Deleonibus, S., Faynot, O., Ernst, T., Vinet, M., Batude, P., Andrieu, F., Weber, O., Cooper, D., Bertin, F., Moriceau, H., DiCioccio, L., Signamarcheix, T., Sanquer, M., Jehl, X., Cueto, O., Fanet, H., Martin, F., Okuno, H., Nemouchi, F., Poupon, G., Lamy, Y., Gasparutto, D., Baillin, X., Duraffourg, L., Arcamone, J., Perniola, L., de Salvo, B., Vianello, E., Hutin, L., Poulain, C., Beigne, E., Tiron, R., Pain, L., Tedesco, S., Barnola, S., Posseme, N., Le Royer, C., Villalon, A., Salot, R.
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
Published in 2014 IEEE International Electron Devices Meeting (01.12.2014)
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Conference Proceeding
Wafer Level Thin Film Encapsulation for BAW RF MEMS
Pornin, J.L., Gillot, C., Parat, G., Jacquet, F., Lagoutte, E., Sillon, N., Poupon, G., Dumont, F.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Wafer level processing of 3D system in package for RF and data application
Souriau, J.-C., Lignier, O., Charrier, M., Poupon, G.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Detailed Characterisation of Ni Microinsert Technology For Flip Chip Die on Wafer Attachment
Mathewson, A., Brun, J., Ponthenier, G., Franiatte, R., Nowodzinski, A., Sillon, N., Poupon, G., Deputot, F., Dubois-Bonvalot, B.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
3D Integration : a technological toolbox
Poupon, G., Scannell, M., di Cioccio, L., Henry, D., Leduc, P., Clavelier, L., Sillon, N.
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
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Conference Proceeding
Wafer level processing on re-built wafer for chip stacking
Souriau, J.-C., Lignier, O., Val, C., Charrier, M., Poupon, G.
Published in 2005 7th Electronic Packaging Technology Conference (2005)
Published in 2005 7th Electronic Packaging Technology Conference (2005)
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Conference Proceeding