METHOD FOR PACKAGING A MICROELECTRONIC DEVICE IN A HERMETICALLY SEALED CAVITY AND MANAGING THE ATMOSPHERE OF THE CAVITY WITH A DEDICATED HOLE
REIG BRUNO, PORNIN JEAN LOUIS, GRECO FLORENT, HENN GUDRUN, SAINT PATRICE DAMIEN, DEN DEKKER ARNOLDUS, GIESEN MARCEL
Year of Publication 09.08.2016
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Year of Publication 09.08.2016
Patent
Low cost Thin Film packaging for MEMS over molded
Pornin, Jean-Louis, Gillot, C, Billard, C, Lagoutte, E, Pellat, M, Parat, G, Sillon, N
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding