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REISS WERNER, SCHMALZL STEFAN, LEE CHEE HONG, CHIN KON HOE, TUAZON BERNARDEZ APRIL COLEEN, LIEW SOON LEE, OTHMAN NURFARENA, CHUA KOK YAU, KUEK HSIEH TING, CHIANG CHAU FATT, BAKAR ROSLIE SAINI BIN, ABDUL WAHID JUNNY, CHONG HOCK HENG, POK PEI LUAN
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Year of Publication 18.06.2019
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Subtractive Metal Structuring on Surface of Semiconductor Package
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Year of Publication 19.09.2024
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Dual step laser processing of an encapsulant of a semiconductor chip package
Lee, Chee Hong, Pok, Pei Luan, Lee, Swee Kah, Bakar, Roslie Saini bin, Leong, Yu Shien, Ng, Yean Seng, Chiang, Chau Fatt, Loh, Jan Sing
Year of Publication 17.10.2023
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Year of Publication 17.10.2023
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Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package
Lee, Chee Hong, Pok, Pei Luan, Lee, Swee Kah, Bakar, Roslie Saini bin, Leong, Yu Shien, Ng, Yean Seng, Chiang, Chau Fatt, Loh, Jan Sing
Year of Publication 18.02.2021
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Year of Publication 18.02.2021
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Subtraktives Metallstrukturieren auf der Oberfläche eines Halbleiterpackages
Lee, Chee Hong, Pok, Pei Luan, Lee, Swee Kah, Chong, Chee Chiew, Paing, Samsun, Goh, Soon Lock
Year of Publication 19.09.2024
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Year of Publication 19.09.2024
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Semiconductor package with air cavity
Abdul Wahid, Junny, Bakar, Roslie Saini bin, Chiang, Chau Fatt, Schmalzl, Stefan, Tuazon Bernardez, April Coleen, Othman, Nurfarena, Lee, Chee Hong, Chong, Hock Heng, Pok, Pei Luan, Kuek, Hsieh Ting, Liew, Soon Lee, Reiss, Werner, Chua, Kok Yau, Chin, Kon Hoe
Year of Publication 15.09.2020
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Year of Publication 15.09.2020
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Semiconductor package and method for fabricating a semiconductor package
Chong, Hock Heng, Ng, Mei Chin, Pok, Pei Luan, Fang, Chee Hong, Ng, Yean Seng, Chiang, Chau Fatt, Muhammad, Muhammat Sanusi, Chung, Khar Foong, Wang, Choon Huey, Chan, Sook Woon
Year of Publication 26.11.2019
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Year of Publication 26.11.2019
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SEMICONDUCTOR PACKAGE WITH AIR CAVITY
KUEK, Hsieh Ting, ABDUL WAHID, Junny, OTHMAN, Nurfarena, CHIANG, Chau Fatt, LEE, Chee Hong, CHONG, Hock Heng, CHUA, Kok Yau, TUAZON BERNARDEZ, April Coleen, CHIN, Kon Hoe, SCHMALZL, Stefan, LIEW, Soon Lee, POK, Pei Luan, REISS, Werner, BAKAR, Roslie Saini bin
Year of Publication 21.08.2019
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Year of Publication 21.08.2019
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Semiconductor Package with Air Cavity
Abdul Wahid, Junny, Bakar, Roslie Saini bin, Chiang, Chau Fatt, Schmalzl, Stefan, Tuazon Bernardez, April Coleen, Othman, Nurfarena, Lee, Chee Hong, Chong, Hock Heng, Pok, Pei Luan, Kuek, Hsieh Ting, Liew, Soon Lee, Reiss, Werner, Chua, Kok Yau, Chin, Kon Hoe
Year of Publication 13.06.2019
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Year of Publication 13.06.2019
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SEMICONDUCTOR PACKAGE WITH AIR CAVITY
KUEK, Hsieh Ting, ABDUL WAHID, Junny, OTHMAN, Nurfarena, CHIANG, Chau Fatt, LEE, Chee Hong, CHONG, Hock Heng, CHUA, Kok Yau, TUAZON BERNARDEZ, April Coleen, CHIN, Kon Hoe, SCHMALZL, Stefan, LIEW, Soon Lee, POK, Pei Luan, REISS, Werner, BAKAR, Roslie Saini bin
Year of Publication 12.06.2019
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Year of Publication 12.06.2019
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Semiconductor package and method for fabricating a semiconductor package
NG, Yean Seng, MUHAMMAD, Muhammat Sanusi, CHAN, Sook Woon, POK, Pei Luan, WANG, Choon Huey, CHIANG, Chau Fatt, CHUNG, Khar Foong, NG, Mei Chin, FANG, Chee Hong, CHONG, Hock Heng
Year of Publication 21.06.2018
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Year of Publication 21.06.2018
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Dual Step Laser Processing of Encapsulant of Semiconductor Chip Package
POK PEI-LUAN, LEE CHEE-HONG, LOH JAN-SING, LEONG YU-SHIEN, CHIANG CHAU-FATT, LEE SWEE-KAH, BAKAR ROSLIE SAINI BIN, NG YEAN-SENG
Year of Publication 23.02.2021
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Year of Publication 23.02.2021
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SEMICONDUCTOR PACKAGE WITH AIR CAVITY
REISS WERNER, SCHMALZL STEFAN, LEE CHEE HONG, CHIN KON HOE, TUAZON BERNARDEZ APRIL COLEEN, LIEW SOON LEE, OTHMAN NURFARENA, CHUA KOK YAU, KUEK HSIEH TING, CHIANG CHAU FATT, BAKAR ROSLIE SAINI BIN, ABDUL WAHID JUNNY, CHONG HOCK HENG, POK PEI LUAN
Year of Publication 12.07.2019
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Year of Publication 12.07.2019
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HALBLEITER-PACKAGE UND VERFAHREN ZUM FERTIGEN EINES HALBLEITER-PACKAGE
Chong, Hock Heng, Ng, Mei Chin, Pok, Pei Luan, Fang, Chee Hong, Ng, Yean Seng, Chiang, Chau Fatt, Muhammad, Muhammat Sanusi, Chung, Khar Foong, Wang, Choon Huey, Chan, Sook Woon
Year of Publication 14.06.2018
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Year of Publication 14.06.2018
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