Copper Ball Voids for Pd-Cu Wires: Affecting Factors and Methods of Controlling
Chu-Chung Lee, Mathew, Varughese, Tran, Tuanh, Ibrahim, Rusli, Poh-Leng Eu
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
High temperature automotive application: A study on fine pitch Au and Cu WB integrity vs. Ni thickness of Ni/Pd/Au bond pad on C90 low k wafer technology
Eu Poh Leng, Poh Zi Song, Au Yin Kheng, Yong, C C, Tran Tu Anh, Arthur, J, Downey, H, Mathew, V, Chee Yit Yin
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Thermally enhanced PBGA: Effect of heat spreader design on plasma cleaning efficiency and wire sweep
Poh-Leng Eu, Ibrahim, R, Kai-Yun Yow
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
A Comparative Study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA Spheres on Ni/Au Finish
Poh-Leng Eu, Huey-Jiun Hoh, Rayos, J., Peng Su, Lindsay, W., Chopin, S., Ahmad, I.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Lead-free Flux Effect in Lead-free Solder Joint Improvement
Eu Poh Leng, Min Ding, Ahmad, I., Hoh Huey Jiun, Hazlinda, K.
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding
Advantages & Challenges of Cold Ball Pull Test vs Conventional Ball Shear Test in the Assessment of Lead-free Solder Joint Performance
Eu Poh Leng, Min Ding, Hoh Huey Jiun, Ahmad, I., Hazlinda, K.
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding
The process characterization of insulated Au-Flash PdCu for the challenging wire bonding applications
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Zhang Xi, Loh Wan Yee, Su Dan, Tok Chee Wei
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
Development and qualification of copper wire bond process for automotive applications
Pey Fang Hiew, Yin Kheng Au, Poh Leng Eu
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Insulated Au-Flash PdCu wire processing and wire bond process robustness improvements for TBGA & LQFP packages
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Zhang Xi, Loh Wan Yee, Su Dan, Tok Chee Wei
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Insulated PdCu wire bond challenges and resolution for HVM robustness
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Au Ying Kheng, Yow Kai Yun, Zhang Xi, Lee, Cheryl, Su Dan, Tok Chee Wei, Murali, Sarangapani, Lyn, Robert
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Challenges and resolution of insulated PdCu wire bond for TBGA HVM robustness
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Au Ying Kheng, Zhang Xi, Lee, Cheryl, Su Dan, Tok Chee Wei, Murali, Sarangapani, Lyn, Robert
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
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Conference Proceeding
Effect of chemical etching solution on Cu/Al IMC result
Wong Boh Kid, Yap Jia Lin, Eu Poh Leng, Yow Kai Yun, Yong, C. C.
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Investigation of bond pad etching chemistries for passivation crack
Ibrahim, Rusli, Leoni, Michael, Au Yin Kheng, Kenny, Poh Zi Song, Poh Leng Eu
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Cu wire bond reliability improvement through focused heat treatment after bonding
Yow Kai Yun, Eu Poh Leng
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding
Improvement of Cu-Al bond integrity on low k pad structures
Wong Boh Kid, Eu Poh Leng, Yong, C. C., Ooi Xin Yi, Yap Boon Kar
Published in 2011 IEEE Regional Symposium on Micro and Nano Electronics (01.09.2011)
Published in 2011 IEEE Regional Symposium on Micro and Nano Electronics (01.09.2011)
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Conference Proceeding
Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint
Pun, K., Poh Leng Eu, Islam, M.N., Cui, C.Q.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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