Linear coefficients of thermal expansion of Au0.5Ni0.5Sn4, Au0.75Ni0.25Sn4, and AuSn4
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Published in Scripta materialia (01.10.2004)
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METHOD FOR VIA PLATING IN ELECTRONIC PACKAGES CONTAINING FLUOROPOLYMER DIELECTRIC LAYERS
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Year of Publication 27.10.2011
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Method of making circuitized substrate with selected conductors having solder thereon
Card, Norman A, Harendza, Robert J, Konrad, John J, Mosher, Tonya L, Pitely, Susan, Rios, Jose A
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Year of Publication 22.03.2011
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Method of making circuitized substrate with selected conductors having solder thereon
CARD NORMAN A, HARENDZA ROBERT J, RIOS JOSE A, KONRAD JOHN J, PITELY SUSAN, MOSHER TONYA L
Year of Publication 22.03.2011
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Year of Publication 22.03.2011
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Method of making circuitized substrate with selected conductors having solder thereon
MOSHER TONYA, CARD NORMAN A, HARENDZA ROBERT J, RIOS JOSE A, KONRAD JOHN J, PITELY SUSAN
Year of Publication 02.10.2008
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Year of Publication 02.10.2008
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