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"PHILLIPS, Kendall Dewayne"
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"PHILLIPS, Kendall Dewayne"
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Hybrid lead frame for semiconductor die package with improved creepage distance
by
Zhang, Lidong
,
Phillips
,
Kendall Dewayne
,
Carpenter, Burton Jesse
,
Chen, Quan
,
Ching, Jr., Mariano Layson
,
Lye, Meng Kong
Year of Publication
04.08.2020
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HYBRID LEAD FRAME FOR SEMICONDUCTOR DIE PACKAGE WITH IMPROVED CREEPAGE DISTANCE
by
CHEN, Quan
,
CARPENTER, Burton Jesse
,
PHILLIPS
,
Kendall Dewayne
,
CHING, JR., Mariano Layson
,
LYE, Meng Kong
,
ZHANG, Lidong
Year of Publication
25.06.2020
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Hybrid lead wire frame for semiconductor pipe core package with improved creepage distance
by
ZHANG LIDONG
,
KENDALL DEWAYNE PHILLIPS
,
CHEN QUAN
,
LYE MENG KONG
,
BURTON JESSE CARPENTER
,
MARIANO LAYSON CH JR
Year of Publication
03.07.2020
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basic electric elements
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electric solid state devices not otherwise provided for
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