Effect of Pad Surface Micro-Texture on Tribological, Thermal and Kinetic Characterizations during Copper Chemical Mechanical Planarization
Han, Ruochen, Mu, Yan, Sampurno, Yasa, Zhuang, Yun, Philipossian, Ara
Published in ECS journal of solid state science and technology (01.01.2017)
Published in ECS journal of solid state science and technology (01.01.2017)
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Journal Article
Characterization of CMP Slurries Using Densitometry and Refractive Index Measurements
Vazquez Bengochea, Leticia, Sampurno, Yasa, Kavaljer, Marcus, Johnston, Rob, Philipossian, Ara
Published in Micromachines (Basel) (24.10.2018)
Published in Micromachines (Basel) (24.10.2018)
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Journal Article
Effect of temperature in titanium chemical mechanical planarization
Mu, Yan, Jiao, Yubo, Sampurno, Yasa, Zhuang, Yun, Theng, Siannie, Philipossian, Ara
Published in Japanese Journal of Applied Physics (01.07.2015)
Published in Japanese Journal of Applied Physics (01.07.2015)
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Journal Article
Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO2 Chemical Mechanical Planarization Performance
McAllister, Jeffrey, Stuffle, Calliandra, Sampurno, Yasa, Hetherington, Dale, Sierra Suarez, Jon, Borucki, Leonard, Philipossian, Ara
Published in Micromachines (Basel) (18.04.2019)
Published in Micromachines (Basel) (18.04.2019)
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Journal Article
Tribological, Thermal and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes
Jiao, Yubo, Liao, Xiaoyan, Wu, Changhong, Theng, Siannie, Zhuang, Yun, Sampurno, Yasa, Goldstein, Michael, Philipossian, Ara
Published in Journal of the Electrochemical Society (01.01.2012)
Published in Journal of the Electrochemical Society (01.01.2012)
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Journal Article
Effect of pad surface micro-texture on dishing and erosion during shallow trench isolation chemical mechanical planarization
Liao, Xiaoyan, Zhuang, Yun, Borucki, Leonard J., Cheng, Jiang, Theng, Siannie, Ashizawa, Toranosuke, Philipossian, Ara
Published in Japanese Journal of Applied Physics (01.08.2014)
Published in Japanese Journal of Applied Physics (01.08.2014)
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Journal Article
Feasibility of real-time detection of abnormality in inter layer dielectric slurry during chemical mechanical planarization using frictional analysis
Sampurno, Yasa, Sudargho, Fransisca, Zhuang, Yun, Goldstein, Michael, Philipossian, Ara
Published in Thin solid films (01.09.2008)
Published in Thin solid films (01.09.2008)
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Journal Article
Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications
Sampurno, Yasa, Borucki, Leonard, Zhuang, Yun, Misra, Sudhanshu, Holland, Karey, Boning, Duane, Philipossian, Ara
Published in Thin solid films (2009)
Published in Thin solid films (2009)
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Journal Article
Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process
Liao, Xiaoyan, Zhuang, Yun, Borucki, Leonard J, Cheng, Jiang, Theng, Siannie, Ashizawa, Toranosuke, Philipossian, Ara
Published in Japanese Journal of Applied Physics (01.01.2013)
Published in Japanese Journal of Applied Physics (01.01.2013)
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Journal Article
Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging
Sun, Ting, Borucki, Len, Zhuang, Yun, Sampurno, Yasa, Sudargho, Fransisca, Wei, Xiaomin, Anjur, Sriram, Philipossian, Ara
Published in Japanese Journal of Applied Physics (01.02.2010)
Published in Japanese Journal of Applied Physics (01.02.2010)
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Journal Article
A Method for Direct Measurement of Substrate Temperature during Copper CMP
Sampurno, Yasa A, Borucki, Leonard, Zhuang, Yun, Boning, Duane, Philipossian, Ara
Published in Journal of the Electrochemical Society (01.01.2005)
Published in Journal of the Electrochemical Society (01.01.2005)
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Journal Article