Enhancing the Wettability of High Aspect-Ratio Through-Silicon Vias Lined With LPCVD Silicon Nitride or PE-ALD Titanium Nitride for Void-Free Bottom-Up Copper Electroplating
Saadaoui, M., van Zeijl, H., Wien, W. H. A., Pham, H. T. M., Kwakernaak, C., Knoops, H. C. M., Erwin Kessels, Wilhelmus M. M., van de Sanden, R. M. C. M., Voogt, F. C., Roozeboom, F., Sarro, P. M.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
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Journal Article
Deterministic Ratchets for Particle Separation Fabricated With Si MEMS Technology
Pham, Hoa T.M., Kulrattanarak, T., van der Sman, R.G.M., Schroen, C.G.P.H., Boom, R.M., Sarro, P.M.
Published in Procedia chemistry (01.09.2009)
Published in Procedia chemistry (01.09.2009)
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Journal Article
In-Situ Isotropic and Anisotropic DRIE Sequence for Massive Parallel Multistage Brownian Ratchets
Pham, H.T.M., Jia Wei, de Boer, C.R., Sarro, P.M.
Published in TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference (01.06.2007)
Published in TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference (01.06.2007)
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Conference Proceeding