C4NP technology: Manufacturability, yields and reliability
Perfecto, Eric D., Hawken, David, Longworth, Hai P., Cox, Harry, Srivastava, Kamalesh, Oberson, Valerie, Shah, Jayshree, Garant, John
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Increased thin film wiring density by stacked vias
Perfecto, E.D., Goldmann, L.
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)
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Conference Proceeding
A low cost MCM-D process for flip chip and wirebonding applications
Perfecto, E.D., Shields, R.R., Master, R.N.
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
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Conference Proceeding
Journal Article
Chip to carrier C4 technology challenges with Pb free solders
Perfecto, E.D., Sundlof, B., Srivastava, K., Lu, M.
Published in 2008 IEEE Custom Integrated Circuits Conference (01.09.2008)
Published in 2008 IEEE Custom Integrated Circuits Conference (01.09.2008)
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Conference Proceeding
Structure for establishing interconnects in packages using thin interposers
Cox, Harry, Fasano, Benjamin V, Indyk, Richard F, Cranmer, Michael S, Sakuma, Katsuyuki, Perfecto, Eric D
Year of Publication 19.06.2018
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Year of Publication 19.06.2018
Patent
METHOD AND STRUCTURE FOR ESTABLISHING INTERCONNECTS IN PACKAGES USING THIN INTERPOSERS
FASANO Benjamin V, COX Harry, CRANMER Michael S, PERFECTO Eric D, INDYK Richard F, SAKUMA Katsuyuki
Year of Publication 25.05.2017
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Year of Publication 25.05.2017
Patent
Method for establishing interconnects in packages using thin interposers
Sakuma Katsuyuki, Perfecto Eric D, Fasano Benjamin V, Indyk Richard F, Cranmer Michael S, Cox Harry
Year of Publication 28.03.2017
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Year of Publication 28.03.2017
Patent
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer
Cox Harry D, Lubguban Jorge A, Erwin Brian M, Perfecto Eric D, Schuler Jennifer D, Arvin Charles L
Year of Publication 08.08.2017
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Year of Publication 08.08.2017
Patent