Wiring structure for trench fuse component with methods of fabrication
Wehella-Gamage Deepal U, Iyer Subramanian S, Pei Chengwen, Kirihata Toshiaki, Maciejewski Edward P
Year of Publication 30.08.2016
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Year of Publication 30.08.2016
Patent
Wiring structure for trench fuse component with methods of fabrication
Wehella-Gamage Deepal U, Iyer Subramanian S, Pei Chengwen, Kirihata Toshiaki, Maciejewski Edward P
Year of Publication 30.08.2016
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Year of Publication 30.08.2016
Patent
Method for forming metal semiconductor alloys in contact holes and trenches
Ozcan Ahmet S, Lavoie Christian, Yu Jian, Li Zhengwen, Pei Chengwen, Papadatos Filippos
Year of Publication 23.08.2016
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Year of Publication 23.08.2016
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Semiconductor device having diffusion barrier to reduce back channel leakage
Freeman Gregory G, Pei Chengwen, Lee Kam Leung, Zhang Yanli, Wang Geng
Year of Publication 02.08.2016
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Year of Publication 02.08.2016
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WIRING STRUCTURE FOR TRENCH FUSE COMPONENT WITH METHODS OF FABRICATION
IYER SUBRAMANIAN S, MACIEJEWSKI EDWARD P, PEI CHENGWEN, KIRIHATA TOSHIAKI, WEHELLA-GAMAGE DEEPAL U
Year of Publication 09.06.2016
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Year of Publication 09.06.2016
Patent