A Temperature-Dependent Thermal Model of IGBT Modules Suitable for Circuit-Level Simulations
Rui Wu, Huai Wang, Pedersen, Kristian Bonderup, Ke Ma, Ghimire, Pramod, Iannuzzo, Francesco, Blaabjerg, Frede
Published in IEEE transactions on industry applications (01.07.2016)
Published in IEEE transactions on industry applications (01.07.2016)
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Journal Article
Comparative Study of Al Metallization Degradation in Power Diodes Under Passive and Active Thermal Cycling
Brincker, Mads, Pedersen, Kristian Bonderup, Kristensen, Peter Kjar, Popok, Vladimir N.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2018)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2018)
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Journal Article
Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules
Pedersen, Kristian Bonderup, Kristensen, Peter Kjær, Popok, Vladimir, Pedersen, Kjeld
Published in Microelectronics and reliability (01.09.2013)
Published in Microelectronics and reliability (01.09.2013)
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Journal Article
Conference Proceeding
Dynamic Modeling Method of Electro-Thermo-Mechanical Degradation in IGBT Modules
Pedersen, Kristian Bonderup, Pedersen, Kjeld
Published in IEEE transactions on power electronics (01.02.2016)
Published in IEEE transactions on power electronics (01.02.2016)
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Journal Article
Ageing monitoring in IGBT module under sinusoidal loading
Ghimire, Pramod, Pedersen, Kristian Bonderup, Rannestad, Bjørn, Munk-Nielsen, Stig
Published in Microelectronics and reliability (01.08.2015)
Published in Microelectronics and reliability (01.08.2015)
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Journal Article
Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules
Pedersen, Kristian Bonderup, Benning, David, Kristensen, Peter Kjær, Popok, Vladimir N., Pedersen, Kjeld
Published in Journal of materials science. Materials in electronics (01.07.2014)
Published in Journal of materials science. Materials in electronics (01.07.2014)
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Journal Article
Degradation evolution in high power IGBT modules subjected to sinusoidal current load
Pedersen, Kristian Bonderup, Østergaard, Lotte Haxen, Kristensen, Peter Kjær, Ghimire, Pramod, Popok, Vladimir N., Pedersen, Kjeld
Published in Journal of materials science. Materials in electronics (01.02.2016)
Published in Journal of materials science. Materials in electronics (01.02.2016)
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Journal Article
Vce as early indicator of IGBT module failure mode
Pedersen, Kristian Bonderup, Kristensen, Peter Kjar, Pedersen, Kjeld, Uhrenfeldt, Christian, Munk-Nielsen, Stig
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
Published in 2017 IEEE International Reliability Physics Symposium (IRPS) (01.04.2017)
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Conference Proceeding
Dynamic control of trip temperature for power module
Pedersen, Kristian Bonderup, Bodiwala, Hardik, Andersen, Thomas Lundgren
Year of Publication 14.03.2023
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Year of Publication 14.03.2023
Patent
DYNAMIC CONTROL OF TRIP TEMPERATURE FOR POWER MODULE
BODIWALA, Hardik, ANDERSEN, Thomas Lundgren, PEDERSEN, Kristian Bonderup
Year of Publication 15.02.2023
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Year of Publication 15.02.2023
Patent
EFFECTIVE COOLING OF ELECTRIC POWER CONVERTER
ANDREASEN, Marcin Blazniak, OLESEN, Anders Christian, PEDERSEN, Kristian Bonderup
Year of Publication 31.03.2022
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Year of Publication 31.03.2022
Patent
DYNAMIC CONTROL OF TRIP TEMPERATURE FOR POWER MODULE
BODIWALA, Hardik, ANDERSEN, Thomas Lundgren, PEDERSEN, Kristian Bonderup
Year of Publication 18.06.2020
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Year of Publication 18.06.2020
Patent
DYNAMIC CONTROL OF TRIP TEMPERATURE FOR POWER MODULE
BODIWALA, Hardik, ANDERSEN, Thomas Lundgren, PEDERSEN, Kristian Bonderup
Year of Publication 17.06.2020
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Year of Publication 17.06.2020
Patent
Test setup for accelerated test of high power IGBT modules with online monitoring of Vce and Vf voltage during converter operation
de Vega, Angel Ruiz, Ghimire, Pramod, Pedersen, Kristian Bonderup, Trintis, Ionut, Beczckowski, Szymon, Munk-Nielsen, Stig, Rannestad, Bjorn, Thogersen, Paul
Published in 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA) (01.05.2014)
Published in 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA) (01.05.2014)
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Conference Proceeding