INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
Park, KyoungHee, Koo, KyoWang, Kim, SungSoo, Han, Byung Joon, Lin, Yaojian, Yoon, In Sang, Chai, SeungYong, Yang, DeokKyung, Lee, Hun Teak, Shim, Il Kwon, Cho, SungWon
Year of Publication 11.10.2018
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Year of Publication 11.10.2018
Patent
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
Park, KyoungHee, Koo, KyoWang, Kim, SungSoo, Han, Byung Joon, Lin, Yaojian, Yoon, In Sang, Chai, SeungYong, Yang, DeokKyung, Lee, Hun Teak, Shim, Il Kwon, Cho, SungWon
Year of Publication 11.10.2018
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Year of Publication 11.10.2018
Patent
Integrated circuit packaging system with shielding and method of manufacturing thereof
Park, KyoungHee, Koo, KyoWang, Kim, SungSoo, Han, Byung Joon, Lin, Yaojian, Yoon, In Sang, Chai, SeungYong, Yang, DeokKyung, Lee, Hun Teak, Shim, Il Kwon, Cho, SungWon
Year of Publication 12.06.2018
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Year of Publication 12.06.2018
Patent
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MANUFACTURE THEREOF
Lee Hun Teak, Lin Yaojian, Koo KyoWang, Cho SungWon, Han Byung Joon, Shim Il Kwon, Yoon In Sang, Kim SungSoo, Park KyoungHee, Yang DeokKyung, Chai SeungYong
Year of Publication 13.10.2016
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Year of Publication 13.10.2016
Patent
Integrated circuit packaging system with shielding and method of manufacture thereof
CHAI, SEUNGYONG, YOON, IN SANG, YANG, DEOKKYUNG, KIM, SUNGSOO, LIN, YAOJIAN, LEE, HUN TEAK, PARK, KYOUNGHEE, CHO, SUNGWON, SHIM, IL KWON, HAN, BYUNG JOON, KOO, KYOWANG
Year of Publication 01.06.2020
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Year of Publication 01.06.2020
Patent