Search Results - "PARK JACKY" :: K.UTB vyhledávací portál

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resin composition for self-assembled conductive bonding film self-assembled conductive bonding film comprising the same and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 27.02.2023

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Patent

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adhesive member adhesive sheet comprising the same and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 19.04.2022

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Patent

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LED LED - self-assembled conductive bonding compound for LED chip bonding having excellent printability LED chip-circuit board bonding module comprising the same and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 01.04.2022

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Patent

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LED LED - self-assembled conductive bonding compound for LED chip bonding having excellent electrical properties LED chip-circuit board bonding module comprising the same and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 01.04.2022

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Patent

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Self-sealing type conductive connection material bonding module including same and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 29.03.2022

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Patent

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LED LED - self-assembled conductive bonding compound for LED chip bonding having excellent adhesion LED chip-circuit board bonding module comprising the same and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 07.02.2022

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Patent

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LED LED - self-assembled conductive bonding compound for LED chip bonding having excellent self-assembly LED chip-circuit board bonding module comprising the same and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 07.02.2022

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Patent

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manufacturing method of circuit member for self-assembled conductive bonding film

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 26.02.2020

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Patent

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self-assembled conductive bonding film and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 30.09.2019

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Patent

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Adhesive resin self-assembled conductive bonding paste comprising the same and manufacturing method thereof

by LIM JAE WOO, LEE DONG HYUN, SHIN JUN SIK, PARK JACKY
Year of Publication 07.05.2019

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Patent

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Self-assembled conductive bonding film

by SHIN, JUN SIK, PARK, JACKY, LIM, JAE WOO, LEE, DONG HYUN
Year of Publication 28.02.2018

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Patent

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Self-assembled conductive bonding Paste

by SHIN, JUN SIK, PARK, JACKY, LIM, JAE WOO, LEE, DONG HYUN
Year of Publication 19.01.2018

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Patent

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Highly light-responsive ink-jet printed 6,13-bis(triisopropylsilylethynyl) pentacene phototransistors with suspended top-contact structure

by Kim, Yong-Hoon, Han, Jeong-In, Han, Min-Koo, Anthony, John E., Park, Jacky, Park, Sung Kyu
Published in Organic electronics (01.09.2010)

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Journal Article

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Miscibility of flame retardant epoxy resin with poly(ethylene terephthalate) and the characterizations of the blends

by Kim, Hwan Chul, Kim, Dong Hwan, Park, Jacky, Lim, Jong Cheol, Park, Young Wan
Published in Fibers and polymers (01.10.2009)

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Journal Article

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FIBER MADE AFTER SOMATIC STRUCTURE AND MANUFACTURING METHOD THEREBY

by KIM, DONG HWAN, PARK, JACKY, KIM, HWAN CHUL, CHUNG, YONG SIK
Year of Publication 13.05.2010

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Patent

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Of Warriors and Scholars: Identities, Interests, and Korean Strategies towards Great Powers

by Park, Sungtae Jacky
Year of Publication 01.01.2015

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Dissertation

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LACK OF COMPASSION: SOONER Edition

by MARY LINDA JACKY BETHEL PARK
Published in Pittsburgh post-gazette (Pittsburgh, Pa. 1978) (21.04.1999)

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Newspaper Article

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