Chip-last FOWLP based antenna-in-package (FO-AiP) for 5G mmWave application
Ahn, Klaus, Park, Jade, Lee, Bruce, Kang, Lewis, Kim, Jay, Shin, Kyeongrok, Kim, Sung Hyuk, Lee, Jea-Duck, Kim, Myoung Kee, Lee, Ho-Seon, Park, Byeong-Gyu, Park, Bok-Ju, Kong, Tong-Ook
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
A Compact 28 GHz RF Front-end Module using IPDs and Wafer-level Metal Fan-out Packaging
Yook, Jong-Min, Kim, Dongsu, Park, Bok-Ju, Sim, Sanghoon, Eo, Yun-Seong, Kim, Jun Chul
Published in 2019 49th European Microwave Conference (EuMC) (01.10.2019)
Published in 2019 49th European Microwave Conference (EuMC) (01.10.2019)
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Conference Proceeding
28 GHz GaAs pHEMT MMICs and RF front‐end module for 5G communication systems
Ahn, Hyun Jun, Chang, Won Il, Kim, Seung Min, Park, Bok Ju, Yook, Jong Min, Eo, Yun Seong
Published in Microwave and optical technology letters (01.04.2019)
Published in Microwave and optical technology letters (01.04.2019)
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Journal Article
28GHz GaAs pHEMT MMICs and RF front‐end module for 5G communication systems
Ahn, Hyun Jun, Won Il Chang, Kim, Seung Min, Park, Bok Ju, Yook, Jong Min, Eo, Yun Seong
Published in Microwave and optical technology letters (01.04.2019)
Published in Microwave and optical technology letters (01.04.2019)
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Journal Article
APPARATUS AND METHOD FOR EXPANDING DYNAMIC RANGE OF POWER AMPLIFIER
PARK, BOK JU, PAEK, JI SEON, YANG, JUN SEOK, LIM, HYUNG SUN, NOH, HEE SANG, BAEK, SANG HYUN, KIM, YOUNG EIL
Year of Publication 24.04.2013
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Year of Publication 24.04.2013
Patent