Properties of isolation liner and electrical characteristics of high aspect ratio TSV in 3D stacking technology
DeokYoung Jung, Kwang-Jin Moon, Byung-Lyul Park, Gilheyun Choi, Ho-Kyu Kang, Chilhee Chung, Deok Young Jung, Yonghan Rho
Published in 2012 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2012)
Published in 2012 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2012)
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Conference Proceeding
Electromigration tests for critical stress and failure mechanism evaluation in Cu/W via/Al hybrid interconnect
Zungsun Choi, Byung-Lyul Park, Jong Myeong Lee, Gil-Heyun Choi, Hyeon-Deok Lee, Joo-Tae Moon
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Conference Proceeding
Printed Circuit Board and method of manufacturing the printed circuit board
OH HYUN JONG, LEE JAE CHAN, PARK BYUNG LYUL, KIM JEONG SEOK, MOON JONG KEUN, YANG JIN KYU
Year of Publication 13.04.2023
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Year of Publication 13.04.2023
Patent
SEMICONDUCTOR PACKAGE
LEE JOO HYUNG, PARK KI TAE, PARK BYUNG LYUL, YUN JONG HO, OH JOON SEOK
Year of Publication 16.12.2021
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Year of Publication 16.12.2021
Patent
Annealing process and structural considerations in controlling extrusion-type defects Cu TSV
Jinho An, Kwang-Jin Moon, Soyoung Lee, Do-Sun Lee, Kiyoung Yun, Byung-Lyul Park, Ho-Jun Lee, Jiwoong Sue, Yeong-Lyeol Park, Gilheyun Choi, Ho-Kyu Kang, Chilhee Chung
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding
Method for manufacturing semiconductor package
AHN, YOUNG GYU, KANG, TAE WOO, PARK, KUN SANG, PARK, BYUNG LYUL, KIM, KYOUNG HWAN
Year of Publication 27.04.2018
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Year of Publication 27.04.2018
Patent