Reliability Challenges in Fabrication of Flexible Hybrid Electronics for Human Performance Monitors: A System-Level Study
Soman, Varun V., Han, Donggeon, Arias, Ana Claudia, Ghose, Kanad, Poliks, Mark D., Turner, James N., Khan, Yasser, Zabran, Madina, Schadt, Mark, Hart, Paul, Shay, Michael, Egitto, Frank D., Papathomas, Konstantinos I., Yamamoto, Natasha A. D.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2019)
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Journal Article
Electrically conductive adhesive (ECA) for multilayer device interconnects
Das Rabindra N, Lauffer John M, Magnuson Roy H, Chan Benson, Papathomas Konstantinos I, Markovich Voya R
Year of Publication 20.09.2016
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Year of Publication 20.09.2016
Patent
Circuitized substrate with low loss capacitive material and method of making same
MCNAMARA JAMES J, DAS RABINDRA N, PAPATHOMAS KONSTANTINOS I, MARKOVICH VOYA R
Year of Publication 21.05.2013
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Year of Publication 21.05.2013
Patent
Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections
Das, R.N., Papathomas, K.I., Lauffer, J.M., Egitto, F.D.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
POLIKS MARK D, DAS RABINDRA N, PAPATHOMAS KONSTANTINOS I, MARKOVICH VOYA R
Year of Publication 11.10.2012
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Year of Publication 11.10.2012
Patent