Resin coated copper capacitive (RC3) nanocomposites for system in a package (SiP): Development of 3-8-3 structure
Das, R.N., Papathomas, K.I., Rosser, S.G., Antesberger, T., Lauffer, J.M., Poliks, M.D., Markovich, V.R.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Get full text
Conference Proceeding
Printable Nanocomposites for Advanced Organic Packaging
Das, R.N., How Lin, Papathomas, K.I., Lauffer, J.M., Card, N., Markovich, V.R.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Get full text
Conference Proceeding