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Year of Publication 01.08.2023
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Year of Publication 06.08.2015
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Year of Publication 06.08.2015
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IMPROVED WAFER COATING
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Year of Publication 06.08.2015
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Year of Publication 06.08.2015
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WATER SOLUBLE MASK FORMATION BY DRY FILM VACUUM LAMINATION FOR LASER AND PLASMA DICING
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Year of Publication 06.08.2015
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Year of Publication 06.08.2015
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Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation processing
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Year of Publication 05.08.2022
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Year of Publication 05.08.2022
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SCREEN PRINT MASK FOR LASER SCRIBE AND PLASMA ETCH WAFER DICING PROCESS
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Year of Publication 11.06.2015
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Year of Publication 11.06.2015
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Etch mask for hybrid laser scribing and plasma etch wafer singulation process
LERNER, ALEXANDER N, KUMAR, PRABHAT, KUMAR, AJAY, LI, WENGUANG, PAPANU, JAMES S, EATON, BRAD, KRISHNAMURTHY, RAMESH
Year of Publication 01.08.2021
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Year of Publication 01.08.2021
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Improved wafer coating
PARK, JUNGRAE, KUMAR, PRABHAT, KUMAR, AJAY, LEI, WEI-SHENG, PAPANU, JAMES S, EATON, BRAD
Year of Publication 01.08.2020
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Year of Publication 01.08.2020
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Dicing wafers having solder bumps on wafer backside
KUMAR, AJAY, LEI, WEI-SHENG, PAPANU, JAMES S, IYER, APARNA, EATON, BRAD
Year of Publication 11.07.2020
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Year of Publication 11.07.2020
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Wafer coating
PARK JUNGRAE, KUMAR PRABHAT, EATON BRAD, LEI WEI-SHENG, KUMAR AJAY, PAPANU JAMES S
Year of Publication 31.03.2015
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Year of Publication 31.03.2015
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