Search Results - "PAPANU JAMES S" :: K.UTB vyhledávací portál

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Water soluble organic-inorganic hybrid mask formulations and their applications

by Li, Wenguang, Papanu, James S
Year of Publication 28.12.2021

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WATER SOLUBLE ORGANIC-INORGANIC HYBRID MASK FORMULATIONS AND THEIR APPLICATIONS

by Li, Wenguang, Papanu, James S
Year of Publication 05.08.2021

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WATER SOLUBLE ORGANIC-INORGANIC HYBRID MASK FORMULATIONS AND THEIR APPLICATIONS

by LI, Wenguang, PAPANU, James S
Year of Publication 07.12.2022

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HYBRID WAFER DICING APPROACH USING A UNIFORM ROTATING BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS

by BALAKRISHNAN, Karthik, PAPANU, James, S, PARK, Jungrae
Year of Publication 22.06.2022

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HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS

by TAN, Zavier, Zai Yeong, PAPANU, James, S, PARK, Jungrae
Year of Publication 16.08.2023

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WATER SOLUBLE ORGANIC-INORGANIC HYBRID MASK FORMULATIONS AND THEIR APPLICATIONS

by LI, Wenguang, PAPANU, James S
Year of Publication 05.08.2021

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AUTOMATIC KERF OFFSET MAPPING AND CORRECTION SYSTEM FOR LASER DICING

by BALAKRISHNAN, Karthik, ABHINAND, Sai, PAPANU, James, S, TAN, Zavier Zai, Yeong, PARK, Jungrae
Year of Publication 09.10.2024

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LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH

by LEI, Wei-Sheng, BALAKRISHNAN, Karthik, TAN, Zavier, Zai Yeong, PAPANU, James S, PARK, Jungrae
Year of Publication 02.10.2024

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HYBRID WAFER DICING APPROACH USING A UNIFORM ROTATING BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS

by Papanu, James S, Park, Jungrae, Balakrishnan, Karthik
Year of Publication 18.02.2021

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Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process

by Papanu, James S, Park, Jungrae, Balakrishnan, Karthik
Year of Publication 26.01.2021

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LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH

by BALAKRISHNAN, KARTHIK, Park, Jungrae, TAN, ZAVIER ZAI YEONG, PAPANU, JAMES S, LEI, WEI-SHENG
Year of Publication 07.03.2024

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HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS

by TAN, Zavier, Zai Yeong, PAPANU, James, S, PARK, Jungrae
Year of Publication 15.06.2022

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METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

by HSIUNG, Chien-Kang, PAPANU, James S, SUNDARRAJAN, Arvind
Year of Publication 09.06.2022

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METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

by HSIUNG, Chien-Kang, PAPANU, James S, SUNDARRAJAN, Arvind
Year of Publication 09.06.2022

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Automatic kerf offset mapping and correction system for laser dicing

by Abhinand, Sai, Papanu, James S, Park, Jungrae, Tan, Zavier Zai Yeong, Balakrishnan, Karthik
Year of Publication 13.02.2024

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Laser scribing trench opening control in wafer dicing using hybrid laser scribing and plasma etch approach

by Papanu, James S, Lei, Wei-Sheng, Park, Jungrae, Tan, Zavier Zai Yeong, Balakrishnan, Karthik
Year of Publication 26.12.2023

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LIGHT-ABSORBING MASK FOR HYBRID LASER SCRIBING AND PLASMA ETCH WAFER SINGULATION PROCESS

by LEI, Wei-Sheng, LERNER, Alexander N, KUMAR, Ajay, LI, Wenguang, PAPANU, James S, EATON, Brad, KUMAR, Prabhat
Year of Publication 16.10.2024

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HYBRID WAFER DICING APPROACH USING A SPATIALLY MULTI-FOCUSED LASER BEAM LASER SCRIBING PROCESS AND PLASMA ETCH PROCESS

by Papanu, James S, Park, Jungrae, Tan, Zavier Zai Yeong
Year of Publication 29.07.2021

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LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING HYBRID LASER SCRIBING AND PLASMA ETCH APPROACH

by LEI, Wei-Sheng, BALAKRISHNAN, Karthik, TAN, Zavier, Zai Yeong, PAPANU, James S, PARK, Jungrae
Year of Publication 26.04.2023

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AUTOMATIC KERF OFFSET MAPPING AND CORRECTION SYSTEM FOR LASER DICING

by BALAKRISHNAN, Karthik, ABHINAND, Sai, PAPANU, James, S, TAN, Zavier Zai, Yeong, PARK, Jungrae
Year of Publication 26.04.2023

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