Semiconductor structure
Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Year of Publication 26.12.2023
Get full text
Year of Publication 26.12.2023
Patent
Package structure with a barrier layer
Li, Chien-Chen, Liu, Kuo-Chio, Wu, Yuan-Feng, Liu, Chun-Chen, Chen, Chen-Shien, Ku, Chin-Yu, Chen, Cheng-Hung, Chiang, Sen-Chi, Huang, Heng-Chi, Hsieh, Cheng-Nan, Hsu, Yu-Nu, Chen, Shih-Yen, Pang, Te-Hsun
Year of Publication 14.05.2024
Get full text
Year of Publication 14.05.2024
Patent
PACKAGE STRUCTURE WITH A BARRIER LAYER
PANG, Te-Hsun, KU, Chin-Yu, LI, Chien-Chen, CHEN, Cheng-Hung, WU, Yuan-Feng, CHEN, Chen-Shien, CHIANG, Sen-Chi, HSU, Yu-Nu, HSIEH, Cheng-Nan, HUANG, Heng-Chi, LIU, Kuo-Chio, LIU, Chun-Chen, CHEN, Shih-Yen
Year of Publication 05.09.2024
Get full text
Year of Publication 05.09.2024
Patent
SEMICONDUCTOR STRUCTURE
Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Year of Publication 11.08.2022
Get full text
Year of Publication 11.08.2022
Patent
Semiconductor structure
Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Year of Publication 31.05.2022
Get full text
Year of Publication 31.05.2022
Patent
Method for forming package structure with a barrier layer
Li, Chien-Chen, Liu, Kuo-Chio, Wu, Yuan-Feng, Liu, Chun-Chen, Chen, Chen-Shien, Ku, Chin-Yu, Chen, Cheng-Hung, Chiang, Sen-Chi, Huang, Heng-Chi, Hsieh, Cheng-Nan, Hsu, Yu-Nu, Chen, Shih-Yen, Pang, Te-Hsun
Year of Publication 11.10.2022
Get full text
Year of Publication 11.10.2022
Patent
Conductive external connector structure and method of forming
Chan, Chien-Pin, Cheng, Yung-Chiuan, Huang, Wei-Chih, Lin, Chi-Hung, Ku, Chin-Yu, Liu, Yuan-Fu, Huang, Chien-Ming, Liu, Chen-Hsun, Lo, Chun-Yen, Shih, Meng-Fu, Chen, Wen-Ming, Hsu, Yu-Nu, Huang, Cheng-Lin, Pang, Te-Hsun
Year of Publication 13.12.2022
Get full text
Year of Publication 13.12.2022
Patent
SEMICONDUCTOR STRUCTURE
Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Year of Publication 14.01.2021
Get full text
Year of Publication 14.01.2021
Patent
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING THE SAME
PANG, Te-Hsun, KU, Chin-Yu, LI, Chien-Chen, CHEN, Cheng-Hung, WU, Yuan-Feng, CHEN, Chen-Shien, CHIANG, Sen-Chi, HSU, Yu-Nu, HSIEH, Cheng-Nan, HUANG, Heng-Chi, LIU, Kuo-Chio, LIU, Chun-Chen, CHEN, Shih-Yen
Year of Publication 17.11.2022
Get full text
Year of Publication 17.11.2022
Patent
Manufacturing method of semiconductor structure
Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Year of Publication 27.10.2020
Get full text
Year of Publication 27.10.2020
Patent
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Year of Publication 05.12.2019
Get full text
Year of Publication 05.12.2019
Patent
Package structure with a barrier layer and method for forming the same
Li, Chien-Chen, Liu, Kuo-Chio, Wu, Yuan-Feng, Liu, Chun-Chen, Chen, Chen-Shien, Ku, Chin-Yu, Chen, Cheng-Hung, Chiang, Sen-Chi, Huang, Heng-Chi, Hsieh, Cheng-Nan, Hsu, Yu-Nu, Chen, Shih-Yen, Pang, Te-Hsun
Year of Publication 20.10.2020
Get full text
Year of Publication 20.10.2020
Patent
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Year of Publication 02.05.2019
Get full text
Year of Publication 02.05.2019
Patent
Semiconductor structure and manufacturing method thereof
Wang, Rung-De, Wang, Chia-Hua, Tsai, Pei-Shing, Ku, Chin-Yu, Liu, Chen-Hsun, Pang, Te-Hsun, Lin, Po-Chang
Year of Publication 30.04.2019
Get full text
Year of Publication 30.04.2019
Patent
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
PANG, Te-Hsun, KU, Chin-Yu, LI, Chien-Chen, CHEN, Cheng-Hung, WU, Yuan-Feng, CHEN, Chen-Shien, CHIANG, Sen-Chi, HSU, Yu-Nu, HSIEH, Cheng-Nan, HUANG, Heng-Chi, LIU, Kuo-Chio, LIU, Chun-Chen, CHEN, Shih-Yen
Year of Publication 04.02.2021
Get full text
Year of Publication 04.02.2021
Patent
Conductive External Connector Structure and Method of Forming
Chan, Chien-Pin, Cheng, Yung-Chiuan, Huang, Wei-Chih, Lin, Chi-Hung, Ku, Chin-Yu, Liu, Yuan-Fu, Huang, Chien-Ming, Liu, Chen-Hsun, Lo, Chun-Yen, Shih, Meng-Fu, Chen, Wen-Ming, Hsu, Yu-Nu, Huang, Cheng-Lin, Pang, Te-Hsun
Year of Publication 26.11.2020
Get full text
Year of Publication 26.11.2020
Patent
Conductive external connector structure and method of forming
Chan, Chien-Pin, Cheng, Yung-Chiuan, Huang, Wei-Chih, Lin, Chi-Hung, Ku, Chin-Yu, Liu, Yuan-Fu, Huang, Chien-Ming, Liu, Chen-Hsun, Lo, Chun-Yen, Shih, Meng-Fu, Chen, Wen-Ming, Hsu, Yu-Nu, Huang, Cheng-Lin, Pang, Te-Hsun
Year of Publication 11.08.2020
Get full text
Year of Publication 11.08.2020
Patent
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
PANG, Te-Hsun, KU, Chin-Yu, LI, Chien-Chen, CHEN, Cheng-Hung, WU, Yuan-Feng, CHEN, Chen-Shien, CHIANG, Sen-Chi, HSU, Yu-Nu, HSIEH, Cheng-Nan, HUANG, Heng-Chi, LIU, Kuo-Chio, LIU, Chun-Chen, CHEN, Shih-Yen
Year of Publication 20.06.2019
Get full text
Year of Publication 20.06.2019
Patent
Conductive External Connector Structure and Method of Forming
Chan, Chien-Pin, Cheng, Yung-Chiuan, Huang, Wei-Chih, Lin, Chi-Hung, Ku, Chin-Yu, Liu, Yuan-Fu, Huang, Chien-Ming, Liu, Chen-Hsun, Lo, Chun-Yen, Shih, Meng-Fu, Chen, Wen-Ming, Hsu, Yu-Nu, Huang, Cheng-Lin, Pang, Te-Hsun
Year of Publication 02.05.2019
Get full text
Year of Publication 02.05.2019
Patent
Conductive external connector structure and method of forming
Chan, Chien-Pin, Cheng, Yung-Chiuan, Huang, Wei-Chih, Lin, Chi-Hung, Ku, Chin-Yu, Liu, Yuan-Fu, Huang, Chien-Ming, Liu, Chen-Hsun, Lo, Chun-Yen, Shih, Meng-Fu, Chen, Wen-Ming, Hsu, Yu-Nu, Huang, Cheng-Lin, Pang, Te-Hsun
Year of Publication 25.12.2018
Get full text
Year of Publication 25.12.2018
Patent