Search Results - "PAN HSIN YU" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Conductive Traces in Semiconductor Devices and Methods of Forming Same

Conductive Traces in Semiconductor Devices and Methods of Forming Same

by Shih Chao-Wen, Pu Han-Ping, Pan Hsin-Yu, Yu Chen-Hua, Hsu Sen-Kuei, Tsai Hao-Yi
Year of Publication 20.10.2016

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Patent

Synchronous rectifier control device and forward synchronous rectifier circuit

Synchronous rectifier control device and forward synchronous rectifier circuit

by Lin, Chun-Ming, Pan, Hsin-Yu
Year of Publication 04.01.2011

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Patent

Optical touch display panel

Optical touch display panel

by HSU YA-LING, PAN HSIN-YU, CHUNG YUEH-HUNG, LIEN CHUNG-MIN
Year of Publication 19.05.2015

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Patent

SUBSTRATE WITH TOUCH FUNCTION AND DISPLAY USING THE SAME

SUBSTRATE WITH TOUCH FUNCTION AND DISPLAY USING THE SAME

by PAN HSIN-YU, CHEN HAN-MING, LIEN CHUNG-MIN
Year of Publication 05.03.2015

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Patent

SEMICONDCUTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDCUTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

by CHUANG, LIPU KRIS, CHEN, SHIH-WEI, CHEN, CHIH-HUA, KUO, TIN-HAO, TSAI, HAO-YI, PAN, HSIN-YU
Year of Publication 11.12.2021

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Patent

Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)

Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)

by Tsao, Pei-Haw, Pan, Hsin-Yu
Year of Publication 01.09.2009

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Patent

Lid Design for Heat Dissipation Enhancement of Die Package

Lid Design for Heat Dissipation Enhancement of Die Package

by LIU YUIH, CHEN CHIN-LIANG, HO KUAN-LIN, PAN HSIN-YU, CHIU SHENG-HSIANG
Year of Publication 02.07.2015

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Patent

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

by CHEN, CHIEN-HSUN, CHEN, WEIIH, HSIEH, WEI-KANG, HU, YU-HSIANG, HUANG, TZU-SUNG, CHIANG, TSUNG-HSIEN, LIU, CHUNG-SHI, CHIANG, YI, HUANG, CHAO-HSIEN, TSENG, MING-HUNG, TSAI, HAO-YI, PAN, HSIN-YU, HUNG, TUAN-YU, WU, BAN-LI
Year of Publication 16.07.2023

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Patent

Flip-chip BGA assembly process

Flip-chip BGA assembly process

by LIU YUIH, CHIU SAO-LING, PAN HSIN-YU, LIN WEI-TING, LU JING RUEI
Year of Publication 10.06.2015

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Patent

Memory device and manufacturing method thereof

Memory device and manufacturing method thereof

by KO, TINGU, CHUANG, LI-PU KRIS, PAN, HSIN-YU, LIU, CHUNG-SHI, PU, HAN-PING, LIU, MING-KAI
Year of Publication 01.08.2021

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Patent

OPTICAL TOUCH DISPLAY PANEL

OPTICAL TOUCH DISPLAY PANEL

by HSU YA-LING, PAN HSIN-YU, CHUNG YUEH-HUNG, LIEN CHUNG-MIN
Year of Publication 10.04.2014

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Patent

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

by PAN HSIN-YU, LIANG SHIH-WEI, YANG CHING-FENG, WU KAIIANG, LIU MING-KAI, MIAO CHIAUN
Year of Publication 23.04.2015

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Patent

Flip-chip BGA assembly process

Flip-chip BGA assembly process

by LIU YUIH, CHIU SAO-LING, PAN HSIN-YU, LIN WEI-TING, LU JING RUEI
Year of Publication 31.03.2015

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Patent

Semicondcutor device and semicondcutor package

Semicondcutor device and semicondcutor package

by PAN, HSIN-YU, CHUANG, LIPU-KRIS, PU, HAN-PING, HSU, SEN-KUEI
Year of Publication 16.03.2019

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Patent

Reinforcement structure for flip-chip packaging

Reinforcement structure for flip-chip packaging

by LIU YU-WEN, PAN HSIN-YU, CHEN HSIEN-WEI, YANG CHING-JUNG, SHIH CHAO-WEN
Year of Publication 19.08.2014

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Patent

Synchronous rectifier control device and forward synchronous rectifier circuit

Synchronous rectifier control device and forward synchronous rectifier circuit

by PAN HSIN-YU, LIN CHUN-MING
Year of Publication 04.01.2011

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Patent

Dam for Three-Dimensional Integrated Circuit

Dam for Three-Dimensional Integrated Circuit

by PAN HSIN-YU, YU CHEN-HUA, WANG TSUNG-DING, HWANG CHIEN LING, CHENG JUNG WEI, SU AN-JHIH
Year of Publication 17.09.2015

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Patent

3D INTEGRATED CIRCUIT PACKAGE PROCESSING WITH PANEL TYPE LID

3D INTEGRATED CIRCUIT PACKAGE PROCESSING WITH PANEL TYPE LID

by PAN HSIN-YU, WANG TSUNG-DING, CHEN KIM HONG, HWANG CHIEN LING, PU HAN-PING, CHENG JUNG WEI
Year of Publication 17.09.2015

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Patent

THERMOELECTRIC COOLER OF FLIP-CHIP SEMICONDUCTOR DEVICE

THERMOELECTRIC COOLER OF FLIP-CHIP SEMICONDUCTOR DEVICE

by CHANG SHIH CHENG, PAN HSIN-YU
Year of Publication 01.07.2010

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Patent

Thermoelectric Cooler for Semiconductor Devices with TSV

Thermoelectric Cooler for Semiconductor Devices with TSV

by CHANG SHIH CHENG, PAN HSIN-YU
Year of Publication 24.06.2010

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Patent

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