Effect of photocatalytic oxidation technology on GaN CMP
Wang, Jie, Wang, Tongqing, Pan, Guoshun, Lu, Xinchun
Published in Applied surface science (01.01.2016)
Published in Applied surface science (01.01.2016)
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Journal Article
A study of chemical products formed on sapphire (0001) during chemical–mechanical polishing
Shi, Xiaolei, Pan, Guoshun, Zhou, Yan, Xu, Li, Zou, Chunli, Gong, Hua
Published in Surface & coatings technology (25.05.2015)
Published in Surface & coatings technology (25.05.2015)
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Journal Article
Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry
Zhou, Yan, Pan, Guoshun, Shi, Xiaolei, Gong, Hua, Luo, Guihai, Gu, Zhonghua
Published in Surface & coatings technology (25.07.2014)
Published in Surface & coatings technology (25.07.2014)
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Journal Article
Extended study of the atomic step-terrace structure on hexagonal SiC (0001) by chemical-mechanical planarization
Shi, Xiaolei, Pan, Guoshun, Zhou, Yan, Zou, Chunli, Gong, Hua
Published in Applied surface science (01.11.2013)
Published in Applied surface science (01.11.2013)
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Journal Article
Investigation on the surface characterization of Ga-faced GaN after chemical-mechanical polishing
Gong, Hua, Pan, Guoshun, Zhou, Yan, Shi, Xiaolei, Zou, Chunli, Zhang, Suman
Published in Applied surface science (30.05.2015)
Published in Applied surface science (30.05.2015)
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Journal Article
Preparation of a novel catalyst (SoFeIII) and its catalytic performance towards the removal rate of sapphire substrate during CMP process
Xu, Li, Zhang, Xin, Kang, Chengxi, Wang, Rongrong, Zou, Chunli, Zhou, Yan, Pan, Guoshun
Published in Tribology international (01.04.2018)
Published in Tribology international (01.04.2018)
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Journal Article
Ultrasonic flexural vibration assisted chemical mechanical polishing for sapphire substrate
Xu, Wenhu, Lu, Xinchun, Pan, Guoshun, Lei, Yuanzhong, Luo, Jianbin
Published in Applied surface science (01.04.2010)
Published in Applied surface science (01.04.2010)
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Journal Article
Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles; pad and sapphire substrate during chemical mechanical polishing (CMP)
Xu, Wenhu, Lu, Xinchun, Pan, Guoshun, Lei, Yuanzhong, Luo, Jianbin
Published in Applied surface science (15.01.2011)
Published in Applied surface science (15.01.2011)
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Journal Article
Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface
Pan, Guoshun, Zhou, Yan, Luo, Guihai, Shi, Xiaolei, Zou, Chunli, Gong, Hua
Published in Journal of materials science. Materials in electronics (01.12.2013)
Published in Journal of materials science. Materials in electronics (01.12.2013)
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Journal Article
Film Thickness of Ionic Liquids Under High Contact Pressures as a Function of Alkyl Chain Length
Xiao, Huaping, Guo, Dan, Liu, Shuhai, Pan, Guoshun, Lu, Xinchun
Published in Tribology letters (01.02.2011)
Published in Tribology letters (01.02.2011)
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Journal Article
Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances
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Conference Proceeding
Journal Article