Realization of atomic-level smooth surface of sapphire (0001) by chemical-mechanical planarization with nano colloidal silica abrasives
Xiaolei Shi, Guoshun Pan, Yan Zhou, Yuhong Liu
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
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Conference Proceeding
The Role of Hydroxyethyl Cellulose (HEC) in the Chemical Mechanical Planarization of Copper
Pan, Yan, Liu, Yuhong, Lu, Xinchun, Pan, Guoshun, Luo, Jianbin
Published in Journal of the Electrochemical Society (01.01.2012)
Published in Journal of the Electrochemical Society (01.01.2012)
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Journal Article
Atomically smooth gallium nitride surfaces generated by chemical mechanical polishing with non-noble metal catalyst(Fe-Nx/C) in acid solution
Li Xu, Guoshun Pan, Chunli Zou, Xiaolei Shi, Yuyu Liu
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
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Conference Proceeding
Influence of colloidal silica dispersion on the decrease of roughness in silicon chemical mechanical polishing
Chen, Gaopan, Luo, Guihai, Pan, Guoshun, Liu, Yuhong, Luo, Haimen
Published in Micro & nano letters (01.07.2016)
Published in Micro & nano letters (01.07.2016)
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Journal Article
CMP of GaN using sulfate radicals generated by metal catalyst
Zou Chunli, Pan Guoshun, Xu Li, Shi Xiaolei, Yuyu Liu
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
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Conference Proceeding
Probing Particle Movement in CMP with Fluorescence Technique
Lei, Jun, Guo, Dan, Luo, Jianbin, Pan, Guoshun
Published in Journal of the Electrochemical Society (01.01.2011)
Published in Journal of the Electrochemical Society (01.01.2011)
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Journal Article
Investigation on the variation of the step-terrace structure on the surface of polished GaN wafer
Gong, Hua, Pan, Guoshun, Zou, Chunli, Zhou, Yan, Xu, Li
Published in Surfaces and interfaces (01.03.2017)
Published in Surfaces and interfaces (01.03.2017)
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Journal Article
Effect of Modified Silica Abrasive Particles on Nanosized Particle Deposition in Final Polishing of Silicon Wafers
Gong, Hua, Pan, Guoshun, Gu, Zhonghua, Zou, Chunli, Liu, Yan
Published in Tribology transactions (04.03.2014)
Published in Tribology transactions (04.03.2014)
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Journal Article
Mechanism of GaN CMP Based on H 2 O 2 Slurry Combined with UV Light
Wang, Jie, Wang, Tongqing, Pan, Guoshun, Lu, Xinchun
Published in ECS journal of solid state science and technology (2015)
Published in ECS journal of solid state science and technology (2015)
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Journal Article