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CHOU, CHIANG, CHEN, CHIH-HAO, CHEN, CHUN-KAI, KO, CHUNGI, PAN, SHINGYANG, LEE, TZE-LIANG, SHIU, JUNG-HAU
Year of Publication 01.05.2018
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Year of Publication 01.05.2018
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Multi-Patterning to Form Vias with Straight Profiles
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Year of Publication 06.02.2018
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Year of Publication 06.02.2018
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Loadlock
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Year of Publication 11.09.2007
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Year of Publication 11.09.2007
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Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method
CHANG, YAO-JEN, HUANG, HUANG-YI, PAN, SHINGYANG, CHEN, KUANIA, HSIEH, CHING-HUA, CHI, CHIHIEN
Year of Publication 16.09.2015
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Year of Publication 16.09.2015
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Method for forming composite barrier layer
HUANG CHENG-LIN, SU LI-LIN, SHUE SHAO-LIN, HSIEH CHING-HUA, PAN SHINGYANG, LEE HSIEN-MING, LIN JINGNG, PENG CHAO-HSIEN, LIANG MONG-SONG
Year of Publication 11.10.2011
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Year of Publication 11.10.2011
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Method and apparatus for fabricating metal layer
TSAI, MING-HSING, PAN, SHINGYANG, LEE, HSIEN-MING, LIN, JINGNG, SU, HUNG-WEN
Year of Publication 21.04.2007
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Year of Publication 21.04.2007
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Physical vapor deposition degas apparatus and method for using the same
PAN, SHINGYANG, LEE, HSIEN-MING, HSIEH, CHING-HUA, HUANG, CHENG-LIN, LIN, JINGNG
Year of Publication 01.08.2006
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Year of Publication 01.08.2006
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Method for simultaneous degas and baking in copper damascene process
HUANG CHENG-LIN, HSIEH CHING-HUA, PAN SHINGYANG, LIN JINGNG, LEE HSIEN-MING, SHUE SHAU-LIN
Year of Publication 18.04.2006
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Year of Publication 18.04.2006
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