TRIMMING AND SAWING PROCESSES IN THE FORMATION OF WAFER-FORM PACKAGES
LAI YU CHIA, HSIEH CHING HUA, CHANG MAO YEN, PAN KUO LUNG, WONG CHENG SHIUAN, LIN HSIU JEN
Year of Publication 15.06.2023
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Year of Publication 15.06.2023
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ALIGNMENT MARK DESIGN FOR WAFER-LEVEL TESTING AND METHOD FORMING THE SAME
LIU CHENG YU, TENG PO YUAN, CHANG MAO YEN, WU CHENG CHIEH, PAN KUO LUNG, TSAI HAO YI, LIN CHIA WEN, CHUN SHU RONG
Year of Publication 24.01.2024
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Year of Publication 24.01.2024
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SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
LIN SHENG CHI, HOU SHANG YUN, LIANG YU MIN, FLESHMAN COLLIN JORDON, HOU HAO CHENG, LEE CHIEN HSUN, PAN KUO LUNG, WANG TSUNG DING, CHENG JUNG WEI, CHUN SHU RONG, CHEN WEI YU
Year of Publication 05.10.2023
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Year of Publication 05.10.2023
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RDL RDL PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
YU CHEN HUA, LAI YU CHIA, TENG PO YUAN, PAN KUO LUNG, TSAI HAO YI, KUO TIN HAO
Year of Publication 30.12.2021
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Year of Publication 30.12.2021
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3D BONDING PASSIVE DEVICES ON ACTIVE DEVICE DIES TO FORM 3D PACKAGES
YU CHEN HUA, LIU CHUNG SHI, PAN KUO LUNG, TSAI HAO YI, LAI CHI HUI, CHUN SHU RONG, KUO TIN HAO
Year of Publication 09.03.2021
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Year of Publication 09.03.2021
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SEGREGATED POWER AND GROUND DESIGN FOR YIELD IMPROVEMENT
LIU CHUNG SHI, YU CHEN HUA, LAI YU CHIA, PAN KUO LUNG, TSAI HAO YI, LAI CHI HUI, CHUN SHU RONG, KUO TIN HAO
Year of Publication 07.07.2021
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Year of Publication 07.07.2021
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INTEGRATED CIRCUIT PACKAGE AND METHOD
LIU CHUNG SHI, YU CHEN HUA, PAN KUO LUNG, TSAI HAO YI, LAI CHI HUI, CHUN SHU RONG, KUO TIN HAO
Year of Publication 07.07.2020
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Year of Publication 07.07.2020
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INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
YU CHEN HUA, HSIEH CHING HUA, PEI HAO JAN, PAN KUO LUNG, TSAI HAO YI, LIN HSIU JEN, KUO TIN HAO
Year of Publication 16.03.2020
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Year of Publication 16.03.2020
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SEMICONDUCTOR PACKAGE AND METHOD
LO TENG YUAN, KUO HUNG YI, PAN KUO LUNG, CHANG CHIH HORNG, TSAI HAO YI, CHUN SHU RONG, KUO TIN HAO
Year of Publication 08.01.2020
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Year of Publication 08.01.2020
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INTEGRATED CIRCUIT PACKAGE AND METHOD
YU CHEN HUA, LAI YU CHIA, PAN KUO LUNG, HWANG CHIEN LING, TSAI HAO YI, CHUN SHU RONG, LEE PEI HSUAN, KUO TIN HAO
Year of Publication 07.07.2020
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Year of Publication 07.07.2020
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PERIPHERAL ELECTRICAL CONNECTION OF PACKAGE ON PACKAGE
HUANG YU CHIH, HSIAO CHING WEN, LIN CHIH WEI, PAN KUO LUNG, CHANG WEI SEN, HU YEN CHANG
Year of Publication 04.09.2014
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Year of Publication 04.09.2014
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Packages with thick RDLs and thin RDLs stacked alternatingly
Kuo, Tin-Hao, Yu, Chen-Hua, Pan, Kuo Lung, Lai, Yu-Chia, Teng, Po-Yuan, Tsai, Hao-Yi
Year of Publication 06.08.2024
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Year of Publication 06.08.2024
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