How do carbon nanotubes fit into the semiconductor roadmap?
Graham, A.P., Duesberg, G.S., Hoenlein, W., Kreupl, F., Liebau, M., Martin, R., Rajasekharan, B., Pamler, W., Seidel, R., Steinhoegl, W., Unger, E.
Published in Applied physics. A, Materials science & processing (01.03.2005)
Published in Applied physics. A, Materials science & processing (01.03.2005)
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Journal Article
Potential of air gap technology by selective ozone/TEOS deposition: Effects of air gap geometry on the dielectric constant
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Conference Proceeding
Evidence for metastable defects in airgap interconnects
Guedj, C., Stich, A., Pamler, W., Gabric, Z., Mondon, F.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Journal Article
Conference Proceeding
Nanoscale FinFETs for low power applications
Rösner, W., Landgraf, E., Kretz, J., Dreeskornfeld, L., Schäfer, H., Städele, M., Schulz, T., Hofmann, F., Luyken, R.J., Specht, M., Hartwich, J., Pamler, W., Risch, L.
Published in Solid-state electronics (01.10.2004)
Published in Solid-state electronics (01.10.2004)
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Journal Article
Platinum contamination issues in ferroelectric memories
Boubekeur, H., Mikolajick, T., Pamler, W., Höpfner, J., Frey, L., Ryssel, H.
Published in Journal of applied physics (15.09.2002)
Published in Journal of applied physics (15.09.2002)
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Journal Article
Three dimensional metallization for vertically integrated circuits
Ramm, P., Bollmann, D., Braun, R., Buchner, R., Cao-Minh, U., Engelhardt, M., Errmann, G., Graßl, T., Hieber, K., Hübner, H., Kawala, G., Kleiner, M., Klumpp, A., Kühn, S., Landesberger, C., Lezec, H., Muth, W., Pamler, W., Popp, R., Renner, E., Ruhl, G., Sänger, A., Scheler, U., Schertel, A., Schmidt, C., Schwarzl, S., Weber, J., Weber, W.
Published in Microelectronic engineering (01.11.1997)
Published in Microelectronic engineering (01.11.1997)
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Journal Article
Some aspects of the high-temperature behavior of bismuth, strontium and barium on silicon surfaces studied by total reflection X-ray fluorescence spectrometry
Kilian, G, Rommel, M, Pamler, W, Unger, E, Höpfner, A, Kolbesen, B.O
Published in SPECTROCHIM. ACTA PART B AT. SPECTROSC (30.11.2001)
Published in SPECTROCHIM. ACTA PART B AT. SPECTROSC (30.11.2001)
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Journal Article
Conference Proceeding
Deposition of titanium nitride/tungsten layers for application in vertically integrated circuits technology
Ruhl, G., Fröschle, B., Ramm, P., Intemann, A., Pamler, W.
Published in Applied surface science (01.10.1995)
Published in Applied surface science (01.10.1995)
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Conference Proceeding
A novel low-temperature (Ba, Sr)TiO3(BST) process with Ti/TiN barrier for Gbit DRAM applications
BEITEL, G, WENDT, H, NAGEL, N, GSCHWANDTNER, A, PAMLER, W, HÖNLEIN, W, DEHM, C, MAZURE, C, FRITSCH, E, WEINRICH, V, ENGELHARDT, M, HASLER, B, RÖHR, T, BERGMANN, R, SCHELER, U, MALEK, K.-H
Published in Microelectronic engineering (01.09.1999)
Published in Microelectronic engineering (01.09.1999)
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Conference Proceeding
New elements in Si technology-a contamination risk?
Pamler, W.
Published in 2001 6th International Symposium on Plasma- and Process-Induced Damage (IEEE Cat. No.01TH8538) (2001)
Published in 2001 6th International Symposium on Plasma- and Process-Induced Damage (IEEE Cat. No.01TH8538) (2001)
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Conference Proceeding
Carbon Nanotubes for Microelectronics?
Graham, Andrew P., Duesberg, Georg S., Seidel, Robert V., Liebau, Maik, Unger, Eugen, Pamler, Werner, Kreupl, Franz, Hoenlein, Wolfgang
Published in Small (Weinheim an der Bergstrasse, Germany) (01.04.2005)
Published in Small (Weinheim an der Bergstrasse, Germany) (01.04.2005)
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