Recent Achievements in Sub-10 nm DSA Lithography for Line/Space Patterning
Navarro, Christophe, Nicolet, Celia, Ariura, Fumi, Chevalier, Xavier, Xu, Kui, Hockey, Mary Ann, Mumtaz, Muhammad, Fleury, Guillaume, Hadziioannou, Georges, Legrain, Antoine, Zelsmann, Marc, Gharbi, Ahmed, Tiron, Raluca, Pain, Laurent, Evangelio, Laura, Fernandez-Regulez, Marta, Perez-Murano, Francesc, Cayrefourcq, Ian
Published in Journal of Photopolymer Science and Technology (01.01.2017)
Published in Journal of Photopolymer Science and Technology (01.01.2017)
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Journal Article
Direct write lithography: the global solution for R&D and manufacturing
Pain, Laurent, Tedesco, Serge, Constancias, Christophe
Published in Comptes rendus. Physique (01.10.2006)
Published in Comptes rendus. Physique (01.10.2006)
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Journal Article
65 nm Device Manufacture Using Shaped E-Beam Lithography
Pain, Laurent, Jurdit, Murielle, Laplanche, Yves, Todeschini, Jérôme, Leininger, Hugues, Tourniol, Sonia, Faure, Romuald, Bossy, Xavier, Palla, Ramiro, Beverina, Alessio, Broekaart, Marcel, Judong, Fabienne, Brosselin, Karine, Depoyan, Linda, Friec, Yannick Le, Leverd, Francois, Jonghe, Veronique De, Josse, Emmanuelle, Hinsinger, Olivier, Brun, Philippe, Henry, Daniel, Woo, Michael, Stolk, Peter, Tavel, Brice, Arnaud, Franck
Published in Japanese Journal of Applied Physics (01.06.2004)
Published in Japanese Journal of Applied Physics (01.06.2004)
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Journal Article
An embedded neutral layer for advanced surface affinity control in grapho-epitaxy directed self-assembly
Delachat, Florian, Gharbi, Ahmed, Pimenta-Barros, Patricia, Fouquet, Antoine, Claveau, Guillaume, Posseme, Nicolas, Pain, Laurent, Nicolet, Célia, Navarro, Christophe, Cayrefourcq, Ian, Tiron, Raluca
Published in Nanoscale (21.06.2018)
Published in Nanoscale (21.06.2018)
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Journal Article
Balancing Block Copolymer Thickness over Template Density in Graphoepitaxy Approach
Barros, Patricia Pimenta, Gharbi, Ahmed, Fouquet, Antoine, Bos, Sandra, Hazart, Jérôme, Delachat, Florian, Chevalier, Xavier, Cayrefourcq, Ian, Pain, Laurent, Tiron, Raluca
Published in Macromolecular materials and engineering (01.11.2017)
Published in Macromolecular materials and engineering (01.11.2017)
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Journal Article
A full-process chain assessment for nanoimprint technology on 200-mm industrial platform
Teyssedre, Hubert, Landis, Stefan, Thanner, Christine, Laure, Maria, Khan, Jonas, Bos, Sandra, Eibelhuber, Martin, Chouiki, Mustapha, May, Michael, Brianceau, Pierre, Pollet, Olivier, Hazart, Jerome, Laviron, Cyrille, Pain, Laurent, Wimplinger, Markus
Published in Advanced optical technologies (27.06.2017)
Published in Advanced optical technologies (27.06.2017)
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Journal Article
Application of scatterometry-based machine learning to control multiple electron beam lithography: AM: Advanced metrology
Figueiro, Nivea, Sanchez, Francisco, Koret, Roy, Shifrin, Michael, Etzioni, Yoav, Wolfling, Shay, Sendelbach, Matthew, Blancquaert, Yoann, Labbaye, Thibault, Rademaker, Guido, Pradelles, Jonathan, Mourier, Lucie, Rey, Stephane, Pain, Laurent
Published in 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.04.2018)
Published in 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.04.2018)
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Conference Proceeding
Influence of process parameters on hydrogen silsesquioxane chemistry at low voltage electron beam exposures
Rio, David, Siegert, Laurent, Derrough, Samir, Constancias, Christophe, Icard, Béatrice, Meynen, Herman, Pain, Laurent
Published in Microelectronic engineering (01.05.2010)
Published in Microelectronic engineering (01.05.2010)
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Journal Article
Conference Proceeding
Status and future of maskless lithography
Henry, Daniel, Gemmink, Jan Willem, Pain, Laurent, Postnikov, Sergei V.
Published in Microelectronic engineering (01.04.2006)
Published in Microelectronic engineering (01.04.2006)
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Journal Article
Conference Proceeding
Overlay Diagnostics of Die-to-die Alignment on the Kulicke and Soffa LITEQ 500 Stepper
Misat, Sylvain, Loktev, Mikhail, Schiedon, Ralph, De Boeij, Jeroen, van der Stam, Michiel, Huang, Chia-Ching, Sixt, Pierre, Al Dujaili, Haidar, Dewolf, Tristan, Allouti, Nacima, Pain, Laurent, Vannuffel, Cyril, Coudrain, Perceval, Garnier, Arnaud
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Die-to-die alignment for lithographic processing of reconstructed wafers
Loktev, Mikhail, Misat, Sylvain I., Schiedon, Ralph, de Boeij, Jeroen, van der Stam, Michiel, Sixt, Pierre, Dujaili, Haidar Al, Dewolf, Tristan, Allouti, Nacima, Pain, Laurent, Vannuffel, Cyril, Coudrain, Perceval, Garnier, Arnaud
Published in 2022 Smart Systems Integration (SSI) (27.04.2022)
Published in 2022 Smart Systems Integration (SSI) (27.04.2022)
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Conference Proceeding
Lamination of dry film epoxy molding compounds for 3D packaging: advances and challenges
Argoud, Maxime, Eleouet, Raphael, Dechamp, Jerome, Allouti, Nacima, Pain, Laurent, Tiron, Raluca, Mori, Daisuke, Asahara, Masahiro, Oi, Yosuke, Kan, Katsushi
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding