Search Results - "PAIK KYUNG-WOOK" :: K.UTB vyhledávací portál

Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability

by Hyoung-Joon Kim, Joo Yeon Lee, Kyung-Wook Paik, Kwang-Won Koh, Won, J., Sihyun Choe, Jin Lee, Jung-Tak Moon, Yong-Jin Park
Published in IEEE transactions on components and packaging technologies (01.06.2003)

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Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy

by JEON, Young-Doo, PAIK, Kyung-Wook, OSTMANN, Adreas, REICHL, Herbert
Published in Journal of electronic materials (2005)

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Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages

by JANG, Jae-Won, SUK, Kyoung-Lim, PAIK, Kyung-Wook, LEE, Soon-Bok
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2012)

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Effect of Conductive Particle Properties on the Reliability of Anisotropic Conductive Film for Chip-on-Glass Applications

by Yim, Myung Jin, Chung, Chang-Kyu, Paik, Kyung Wook
Published in IEEE transactions on electronics packaging manufacturing (01.10.2007)

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Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

by KIM, Il, JANG, Kyung-Woon, SON, Ho-Young, KIM, Jae-Han, PAIK, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2011)

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Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

by Kim, Youngsoon, Lee, Seyong, Shin, Ji-won, Paik, Kyung-Wook
Published in Journal of electronic materials (01.06.2016)

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Grain Morphology of Intermetallic Compounds at Solder Joints

by Choi, Won Kyoung, Jang, Se-Young, Kim, Jong Hoon, Paik, Kyung-Wook, Lee, Hyuck Mo
Published in Journal of materials research (01.03.2002)

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Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications

by Yim, Myung Jin, Paik, Kyung Wook
Published in International journal of adhesion and adhesives (01.08.2006)

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Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

by Yang, Se Young, Jeon, Young-Doo, Lee, Soon-Bok, Paik, Kyung-Wook
Published in Microelectronics and reliability (01.02.2006)

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Wafer-Level Flip Chip Packages Using Preapplied Anisotropic Conductive Films (ACFs)

by SON, Ho-Young, CHUNG, Chang-Kyu, YIM, Myung-Jin, HWANG, Jin-Sang, PAIK, Kyung-Wook, JUNG, Gi-Jo, LEE, Jun-Kyu
Published in IEEE transactions on electronics packaging manufacturing (01.07.2007)

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Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs

by Kwon, Woon-Seong, Paik, Kyung-Wook
Published in Journal of applied polymer science (15.09.2004)

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Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs)

by CHUNG, Chang-Kyu, PAIK, Kyung-Wook
Published in IEEE transactions on electronics packaging manufacturing (01.04.2009)

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Effects of Thermal Cycling on Material Properties of Nonconductive Pastes (NCPs) and the Relationship Between Material Properties and Warpage Behavior During Thermal Cycling

by Jang, Kyung-Woon, Kim, Hyoung-Joon, Chung, Chang-Kyu, Paik, Kyung-Wook
Published in IEEE transactions on components and packaging technologies (01.09.2008)

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Formation of Pb/63Sn solder bumps using a solder droplet jetting method

by SON, Ho-Young, NAH, Jae-Woong, PAIK, Kyung-Wook
Published in IEEE transactions on electronics packaging manufacturing (01.07.2005)

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Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

by Myung Jin Yim, Myung Jin Yim, In Ho Jeong, In Ho Jeong, Hyung-Kyu Choi, Hyung-Kyu Choi, Jin-Sang Hwang, Jin-Sang Hwang, Jin-Yong Ahn, Jin-Yong Ahn, Woonseong Kwon, Woonseong Kwon, Kyung-Wook Paik, Kyung-Wook Paik
Published in IEEE transactions on components and packaging technologies (01.12.2005)

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$A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20- \mu m Fine-Pitch Interconnection$

A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20- \mu m Fine-Pitch Interconnection

by Lee, Sang-Hoon, Yoon, Dal-Jin, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2019)

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Nanofiber Anisotropic Conductive Films (ACF) for Ultra-Fine-Pitch Chip-on-Glass (COG) Interconnections

by Lee, Sang-Hoon, Kim, Tae-Wan, Suk, Kyung-Lim, Paik, Kyung-Wook
Published in Journal of electronic materials (01.11.2015)

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Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

by KIM, Hyoung-Joon, CHO, Jong-Soo, PARK, Yong-Jin, LEE, Jin, PAIK, Kyung-Wook
Published in Journal of electronic materials (01.10.2004)

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Contraction Stresses Development of Anisotropic Conductive Films (ACFs) Flip Chip Interconnection: Prediction and Measurement

by Kwon, W.-S., Yang, S.-Y., Lee, S.-B., Paik, K.-W.
Published in IEEE transactions on components and packaging technologies (01.09.2006)

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Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards

by Chung, Chang-Kyu, Kwon, Woon-Seong, Jang, Kyung-Woon, Park, Jin-Hyoung, Lee, Soon-Bok, Paik, Kyung-Wook
Published in IEEE transactions on components and packaging technologies (01.09.2007)

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