Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out Packages
JongHo Park, HanMin Lee, SeYoung Lee, Youjin Kyung, Jung Hak Kim, Kwangjoo Lee, Kyung-Wook Paik
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Effects of Polymer Ball Size and Polyvinylidene Fluoride Nanofiber on the Ball Capture Rate for 100- \mu \text -Pitch Flex-on-Flex Assembly Using Anisotropic Conductive Films and Ultrasonic Bonding Method
Park, Jae-Hyeong, Kim, Tae-Wan, Zhang, Shuye, Paik, Kyung-Wook
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2016)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2016)
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Journal Article
Under bump metallurgy study for Pb-free bumping
JANG, Se-Young, WOLF, Juergen, PAIK, Kyung-Wook
Published in Journal of electronic materials (01.05.2002)
Published in Journal of electronic materials (01.05.2002)
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Journal Article
Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF (Chip-in-Flex) Packages at Humid Environment
Ji-Hye Kim, Tae-Ik Lee, Taek-Soo Kim, Kyung-Wook Paik
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
A Study on the Fine Pitch Flex-on-Flex (FOF) Assembly Using Flux Added Nanofiber Solder Anisotropic Conductive Films (ACFs) and Thermo-Compression Bonding Method
Ji-Soo Lee, Ji-Hye Kim, Kyung-Wook Paik
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Effect of Material Properties of Double-Layer Non Conductive Films (D-NCFs) on the Reflow Reliability of Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro Bump Interconnection
Seyong Lee, Jiwon Shin, Woojeong Kim, Taejin Choi, Kyung-Wook Paik
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
A Study on the Novel Nylon Anchoring Polymer Layer(APL) Anisotropic Conductive Films(ACFs) for Ultra Fine Pitch Chip-on-Glass(COG) Applications
Dal-Jin Yoon, Sanh Hoon Lee, Kyung-Wook Paik
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection
SeYong Lee, Ji-Won Shin, Hyeong Gi Lee, Young Soon Kim, Kyung-Wook Paik
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly
HanMin Lee, SeYong Lee, Park, JongHo, Chang-kyu Chung, Kyung-Woon Jang, Il Kim, SeongWoo Choi, Kyung-Wook Paik
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Investigation of flip chip under bump metallization systems of Cu pads
Nah, Jae-Woong, Paik, Kyung-Wook
Published in IEEE transactions on components and packaging technologies (01.03.2002)
Published in IEEE transactions on components and packaging technologies (01.03.2002)
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Journal Article
A Study on the Cu-Rod Anisotropic Conductive Films (ACFs) for Flex-on-Fabric (FOF) Interconnections Using an Ultrasonic Bonding Method
Seung-Yoon Jung, Hye Eun Hong, Kyung-Wook Paik
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
High Power and High Reliability Flex-On-Board Assembly Using Solder Anisotropic Conductive Films Combined With Ultrasonic Bonding Technique
Kiwon Lee, Saarinen, I. J., Pykari, L., Kyung Wook Paik
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2011)
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Journal Article