Gallium‐Based Liquid‐Metal Alloys: Challenges and Risk Management in High‐Humidity Environments
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Published in Advanced engineering materials (01.08.2024)
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Liquid Metal based Low Resistance Interconnect Technology
Meyyappan, Karumbu, Tadayon, Pooya, Murtagian, Gregorio, Nekkanty, Srikant, Ouvarov-Bancalero, Valery, Lin, Ziyin, Lu, Xiao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2023)
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Year of Publication 05.10.2023
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PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS
MEYYAPPAN, Karumbu Nathan, MARIN, Brandon Christian, IBRAHIM, Tarek A, XU, Dingying, OUVAROV-BANCALERO, Valery
Year of Publication 15.12.2022
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Year of Publication 15.12.2022
Patent
PACKAGE SUBSTRATE Z-DISAGGREGATION WITH LIQUID METAL INTERCONNECTS
Marin, Brandon Christian, Xu, Dingying, Ibrahim, Tarek A, Meyyappan, Karumbu Nathan, Ouvarov-Bancalero, Valery
Year of Publication 15.12.2022
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Year of Publication 15.12.2022
Patent
Package substrate Z-disaggregation with liquid metal interconnects
MARIN, BRANDON, OUVAROV-BANCALERO, VALERY, XU, DINGYING, MEYYAPPAN, KARUMBU NATHAN, IBRAHIM, TAREK A
Year of Publication 01.05.2023
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Year of Publication 01.05.2023
Patent