BPN a new thick negative photoresist with high aspect ratio for MEMS applications
Bourrier, D., Dilhan, M., Ghannam, A., Ourak, L., Granier, H.
Published in Microsystem technologies (01.03.2013)
Published in Microsystem technologies (01.03.2013)
Get full text
Journal Article
Conference Proceeding
Efficent low cost process for single step metal forming of 3D interconnected above-IC inductors
Ghannam, A., Ourak, L., Bourrier, D., Viallon, C., Parra, T.
Published in 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2011)
Published in 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC) (01.09.2011)
Get full text
Conference Proceeding
Implementation of an Oriented Positioning on a Car-Like Mobile Robot by Fuzzy Control
Ouadah, N., Ourak, L., Hamerlain, M., Boudjema, F.
Published in IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics (01.11.2006)
Published in IECON 2006 - 32nd Annual Conference on IEEE Industrial Electronics (01.11.2006)
Get full text
Conference Proceeding
Low cost 3D multilevel interconnect integration for RF and microwave applications
Ghannam, A., Bourrier, D., Ourak, L., Viallon, C., Parra, T.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Get full text
Conference Proceeding