Integrated Thermal Management Strategies for 3D Chip Stacking with Through-Silicon Vias (TSV)
Oukaira, Aziz, Oumlaz, Maroua, Zbitou, Jamal, Lakhssassi, Ahmed
Published in 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) (16.05.2024)
Published in 2024 4th International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET) (16.05.2024)
Get full text
Conference Proceeding