Characterization and modeling of oxide chemical-mechanical polishing using planarization length and pattern density concepts
Ouma, D.O., Boning, D.S., Chung, J.E., Easter, W.G., Saxena, V., Misra, S., Crevasse, A.
Published in IEEE transactions on semiconductor manufacturing (01.05.2002)
Published in IEEE transactions on semiconductor manufacturing (01.05.2002)
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Journal Article
Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing
Stine, B.E., Ouma, D.O., Divecha, R.R., Boning, D.S., Chung, J.E., Hetherington, D.L., Harwoo, C.R., Nakagawa, O.S., Soo-Young Oh
Published in IEEE transactions on semiconductor manufacturing (01.02.1998)
Published in IEEE transactions on semiconductor manufacturing (01.02.1998)
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Journal Article
Implementation of MEMCAD system for electrostatic and mechanical analysis of complex structures from mask descriptions
Gilbert, J.R., Osterberg, P.M., Harris, R.M., Ouma, D.O., Cai, X., Pfajfer, A., White, J., Senturia, S.D.
Published in Micro Electro Mechanical Systems (1993)
Published in Micro Electro Mechanical Systems (1993)
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