Reliability of lead-free solders for die attach in automotive power modules
Ottinger, Bettina, Holverscheid, Joshua, Konig, Sebastian, Jerichow, Edgar, Lunz, Sebastian, Sprenger, Mario, Muller, Lars, Goth, Christian, Franke, Jorg
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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