Degradation Mechanism of Pressure-Assisted Sintered Silver by Thermal Shock Test
Wakamoto, Keisuke, Otsuka, Takukazu, Nakahara, Ken, Namazu, Takahiro
Published in Energies (Basel) (01.09.2021)
Published in Energies (Basel) (01.09.2021)
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Journal Article
Temperature Dependence on Tensile Mechanical Properties of Sintered Silver Film
Wakamoto, Keisuke, Mochizuki, Yo, Otsuka, Takukazu, Nakahara, Ken, Namazu, Takahiro
Published in Materials (13.09.2020)
Published in Materials (13.09.2020)
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Journal Article
Degradation Mechanism of Silver Sintering Die Attach Based on Thermal and Mechanical Reliability Testing
Wakamoto, Keisuke, Otsuka, Takukazu, Nakahara, Ken, Mugilgeethan, Vijendran, Matsumoto, Ryosuke, Namazu, Takahiro
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2023)
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Journal Article
Development of SiC diodes, power MOSFETs and intelligent power modules
Nakamura, Takashi, Miura, Mineo, Kawamoto, Noriaki, Nakano, Yuki, Otsuka, Takukazu, Oku-mura, Keiji, Kamisawa, Akira
Published in Physica status solidi. A, Applications and materials science (01.10.2009)
Published in Physica status solidi. A, Applications and materials science (01.10.2009)
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Journal Article
Fracture Mechanism of Sintered Silver Film Revealed by In Situ SEM Uniaxial Tensile Loading
Wakamoto, Keisuke, Yasugi, Daisuke, Otsuka, Takukazu, Nakahara, Ken, Namazu, Takahiro
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2024)
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Journal Article
SEMICONDUCTOR DEVICE
UMEGAMI Hirokatsu, OTSUKA Takukazu, SAKAI Hiroto, YOSHIHARA Katsuhiko
Year of Publication 23.11.2023
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Year of Publication 23.11.2023
Patent
The Influence of Mechanical Property on the Heat-Cycle Reliability of Sintered Silver Die Attach
Wakamoto, Keisuke, Mochizuki, Yo, Otsuka, Takukazu, Nakahara, Ken, Namazu, Takahiro
Published in 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.09.2020)
Published in 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) (01.09.2020)
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Conference Proceeding
Stacked resin structure for reducing warpage of transfer-molded modules
Iwahashi, Seita, Otsuka, Takukazu, Nakamura, Takashi
Published in 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) (01.05.2017)
Published in 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) (01.05.2017)
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Conference Proceeding