Synthesis and properties of BCDA-based polyimide-clay nanocomposites
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Published in Polymer international (01.06.2007)
Published in Polymer international (01.06.2007)
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Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
Lie Liu, Sung Yi, Lin Seng Ong, Chian, K.S., Osiyemi, S., Sin Heng Lim, Fei Su
Published in IEEE transactions on electronics packaging manufacturing (01.10.2005)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2005)
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