by Dragulinescu, Ana-Maria, Balaceanu, Cristina, Osiac, Filip Emanuel, Roscaneanu, Roxana, Chedea, Veronica Sanda, Suciu, George, Paun, Mirel Ciprian, Bucuci, Stefania
Published in 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) (27.10.2021)