Extended C-band tunable multi-channel InP-based coherent receiver PICs
Hosseini, A, Lu, M, Going, R, Samra, P, Amiralizadeh, S, Nguyen, A, Rahn, J, Dominic, V, Awadalla, A, Corzine, S, Kim, N, Summers, J, Gold, D, Tang, J, Tsai, H-S, Weidner, K, Abolghasem, P, Lauermann, M, Zhang, J, Yan, J, Vallaitis, T, Gilardi, G, Dentai, A, Modi, N, Evans, P, Lal, V, Kuntz, M, Pavinski, D, Ziari, M, Osenbach, J, Missey, M, James, A, Butrie, T, Sun, H, Wu, K-T, Mitchell, M, Reffle, M, Welch, D, Kish, F
Published in Optics express (07.08.2017)
Published in Optics express (07.08.2017)
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Sn-whiskers: truths and myths
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Sn Corrosion and Its Influence on Whisker Growth
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Published in IEEE transactions on electronics packaging manufacturing (01.01.2007)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2007)
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Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage
Osenbach, J., Amin, A., Bachman, M., Baiocchi, F., Bitting, D., Crouthamel, D., DeLucca, J., Gerlach, D., Goodell, J., Peridier, C., Stahley, M., Weachock, R.
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Published in Journal of electronic materials (01.02.2009)
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Failure mechanism of avalanche photodiodes in the presence of water vapor
Comizzoli, R.B., Osenbach, J.W., Crane, G.R., Peins, G.A., Siconolfi, D.J., Lorimor, O.G., Chang, C.-C.
Published in Journal of lightwave technology (01.02.2001)
Published in Journal of lightwave technology (01.02.2001)
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800G over 1000 km enabled by real-time DSP ASIC employing Probabilistic Shaping and Digital Sub-Carrier Multiplexing
Sun, H., Torbatian, M., Karimi, M., Maher, R., Thomson, S., Tehrani, M., Gao, Y., Kumpera, A., Soliman, G., Kakkar, A., Osman, M., El-Sahn, Z. A., Doggart, C., Hou, W., Sutarwala, S., Wu, Y., Chitgarha, M. Reza, Lal, V., Tsai, H.-S., Corzine, S., Zhang, J., Osenbach, J., Buggaveeti, S., Morbi, Z., Olmedo, M. Iglesias, Leung, I., Xu, X., Samra, P., Dominic, V., Sanders, S., Ziari, M., Napoli, A., Spinnler, B., Wu, K.-T., Kandappan, P.
Published in 2020 22nd International Conference on Transparent Optical Networks (ICTON) (01.07.2020)
Published in 2020 22nd International Conference on Transparent Optical Networks (ICTON) (01.07.2020)
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Conference Proceeding
2\times 800 Gbps/wave Coherent Optical Module Using a Monolithic InP Transceiver PIC
Chitgarha, M. R., Studenkov, P., Zhang, J., Hodaei, H., Frost, T., Tsai, H., Buggaveeti, S., Rashidinejad, A., Yekani, A., Nejad, R. Mirzaei, Kerns, S., Diniz, J., Pavinski, D., Brigham, R., Foo, B., Al-Khateeb, M., Koenig, S., Wolf, S., Going, R., Porto, S., Leung, I., Maher, R., Dominic, V., Sun, H., Sanders, S., Osenbach, J., Corzine, S., Evans, P., Lal, V., Ziari, M.
Published in 2020 European Conference on Optical Communications (ECOC) (01.12.2020)
Published in 2020 European Conference on Optical Communications (ECOC) (01.12.2020)
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Conference Proceeding
2-Channels × 100 GBd 32QAM Transmission over 500 km Enabled by InP PICs and SiGe ASICs
Wolf, S, Going, R, Porto, S, Xu, X, Maher, R, Studenkov, P, Lal, V, Tsai, H, Corzine, S, Zhang, J, Behnia, B, Di Giovanni, C, Vallaitis, T, Yan, J, Osenbach, J, Kuntz, M, Ellis, B, Frost, T, Pavinski, D, Mousavi, H, Buggaveeti, S, Hodaei, H, Wang, Z, Evans, P, Sanders, S, Rahn, J, Butrie, T, Ziari, M, Welch, D, Kish, F
Published in 45th European Conference on Optical Communication (ECOC 2019) (2019)
Published in 45th European Conference on Optical Communication (ECOC 2019) (2019)
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Conference Proceeding
high-reliability 1.3-μm InP-based uncooled lasers in nonhermetic packages
CHAND, N, OSENBACH, J. W, EVANOSKY, T. L, COMIZZOLI, R. B, TSANG, W. T
Published in IEEE journal of quantum electronics (01.09.1996)
Published in IEEE journal of quantum electronics (01.09.1996)
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Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory
Osenbach, J.W., Shook, R.L., Vaccaro, B.T., Potteiger, B.D., Amin, A.N., Hooghan, K.N., Suratkar, P., Ruengsinsub, P.
Published in IEEE transactions on electronics packaging manufacturing (01.01.2005)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2005)
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Advanced failure analysis of circuit-under-pad (CUP) structures in Cu/FSG and Cu/low k technologies
Huixian Wu, Archer, V., Merchant, S.M., Cargo, J., Chesire, D., Antol, J., Mengel, R., Osenbach, J., Horvat, S., Peridier, C., White, M.
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
Published in 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual (2005)
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Conference Proceeding
Molecular beam deposition of high quality silicon oxide dielectric films
NARESH CHAND, JOHNSON, J. E, OSENBACH, J. W, LIANG, W. C, FELDMAN, L. C, TSANG, W. T, KRAUTTER, H. W, PASSLACK, M, HULL, R, SWAMINATHAN, V
Published in Journal of crystal growth (01.03.1995)
Published in Journal of crystal growth (01.03.1995)
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Characterization of oxygen-doped, plasma-deposited silicon nitride
KNOLLE, W. R, OSENBACH, J. W, ELIA, A
Published in Journal of the Electrochemical Society (01.05.1988)
Published in Journal of the Electrochemical Society (01.05.1988)
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