Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds
Ceric, H., Zahedmanesh, H., Croes, K., Lacerda de Orio, R., Selberherr, S.
Published in Journal of applied physics (14.03.2023)
Published in Journal of applied physics (14.03.2023)
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Journal Article
Electromigration failure in a copper dual-damascene structure with a through silicon via
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Journal Article
Conference Proceeding
Coupled simulation to determine the impact of across wafer variations in oxide PECVD on electrical and reliability parameters of through-silicon vias
Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Minixhofer, R., Filipovic, L., de Orio, R.L., Selberherr, S.
Published in Microelectronic engineering (02.04.2015)
Published in Microelectronic engineering (02.04.2015)
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Journal Article
Two-pulse magnetic field-free switching scheme for perpendicular SOT-MRAM with a symmetric square free layer
de Orio, R.L., Makarov, A., Goes, W., Ender, J., Fiorentini, S., Sverdlov, V.
Published in Physica. B, Condensed matter (01.02.2020)
Published in Physica. B, Condensed matter (01.02.2020)
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Journal Article
An analytical approach for physical modeling of hot-carrier induced degradation
Tyaginov, S., Starkov, I., Enichlmair, H., Jungemann, Ch, Park, J.M., Seebacher, E., Orio, R., Ceric, H., Grasser, T.
Published in Microelectronics and reliability (01.09.2011)
Published in Microelectronics and reliability (01.09.2011)
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Journal Article
Electromigration Degradation of Gold Interconnects: A Statistical Study
Ceric, H., de Orio, R. L., Selberherr, S.
Published in 2022 IEEE International Interconnect Technology Conference (IITC) (27.06.2022)
Published in 2022 IEEE International Interconnect Technology Conference (IITC) (27.06.2022)
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Conference Proceeding
Impact of parameter variability on electromigration lifetime distribution
Ceric, H, de Orio, R L, Selberherr, S
Published in 2010 International Conference on Simulation of Semiconductor Processes and Devices (01.09.2010)
Published in 2010 International Conference on Simulation of Semiconductor Processes and Devices (01.09.2010)
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Conference Proceeding
Spin Transfer Torques in Ultra-Scaled MRAM Cells
Bendra, M., Fiorentini, S., Ender, J., de Orio, R. L., Hadamek, T., Loch, W. J., Jorstad, N. P., Selberherr, S., Goes, W., Sverdlov, V.
Published in 2022 45th Jubilee International Convention on Information, Communication and Electronic Technology (MIPRO) (23.05.2022)
Published in 2022 45th Jubilee International Convention on Information, Communication and Electronic Technology (MIPRO) (23.05.2022)
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Conference Proceeding
Coupled spin and charge drift-diffusion approach applied to magnetic tunnel junctions
Fiorentini, S., Ender, J., Selberherr, S., de Orio, R.L., Goes, W., Sverdlov, V.
Published in Solid-state electronics (01.12.2021)
Published in Solid-state electronics (01.12.2021)
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Journal Article
Comprehensive evaluation of torques in ultra-scaled MRAM devices
Fiorentini, S., Ender, J., Selberherr, S., de Orio, R.L., Goes, W., Sverdlov, V.
Published in Solid-state electronics (01.01.2023)
Published in Solid-state electronics (01.01.2023)
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Journal Article
Two-pulse switching scheme and reinforcement learning for energy efficient SOT-MRAM simulations
de Orio, R.L., Ender, J., Fiorentini, S., Goes, W., Selberherr, S., Sverdlov, V.
Published in Solid-state electronics (01.11.2021)
Published in Solid-state electronics (01.11.2021)
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Journal Article
Improving failure rates in pulsed SOT-MRAM switching by reinforcement learning
Ender, J., de Orio, R.L., Fiorentini, S., Selberherr, S., Goes, W., Sverdlov, V.
Published in Microelectronics and reliability (01.11.2021)
Published in Microelectronics and reliability (01.11.2021)
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Journal Article
Temperature increase in STT-MRAM at writing: A fully three-dimensional finite element approach
Hadámek, T., Fiorentini, S., Bendra, M., Ender, J., de Orio, R.L., Goes, W., Selberherr, S., Sverdlov, V.
Published in Solid-state electronics (01.07.2022)
Published in Solid-state electronics (01.07.2022)
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Journal Article
A method to determine critical circuit blocks for electromigration based on temperature analysis
Nunes, R.O., Ramirez, J.L., de Orio, R.L.
Published in Microelectronics and reliability (01.11.2020)
Published in Microelectronics and reliability (01.11.2020)
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Journal Article