Development of Materials Informatics Platform
Orii, Yasumitsu, Hirose, Shuichi, Fujita, Akihiro, Kobayashi, Masakazu
Published in Journal of Photopolymer Science and Technology (01.01.2021)
Published in Journal of Photopolymer Science and Technology (01.01.2021)
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Journal Article
Temperature Driven Current-Voltage Characteristics of Ionic Liquid Type Intelligent Connection Device
Kobayashi, Masakazu, Orii, Yasumitsu, Shima, Hisashi, Naitoh, Yasuhisa, Akinaga, Hiroyuki, Sato, Dan, Matsuo, Takuma, Kinoshita, Kentaro, Nokami, Toshiki, Itoh, Toshiyuki
Published in IEEE journal of the Electron Devices Society (2022)
Published in IEEE journal of the Electron Devices Society (2022)
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Journal Article
Semiconductor Packaging Revolution in the Era of Chiplets
Orii, Yasumitsu
Published in 2023 International Conference on IC Design and Technology (ICICDT) (25.09.2023)
Published in 2023 International Conference on IC Design and Technology (ICICDT) (25.09.2023)
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Conference Proceeding
Development of Liquid Photoresist for IMS (Injection Molded Solder) with High Thermal Stability
Mukawa, Jun, Takahashi, Seiichirou, Kobata, Chihiro, Ohkita, Kenzo, Kusumoto, Shiro, Hasegawa, Koichi, Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, Orii, Yasumitsu
Published in Journal of Photopolymer Science and Technology (01.01.2016)
Published in Journal of Photopolymer Science and Technology (01.01.2016)
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Journal Article
Development of Liquid Photoresist for IMS (Injection Molded Solder) with High Thermal Stability
Mukawa, Jun, Takahashi, Seiichirou, Kobata, Chihiro, Ohkita, Kenzo, Kusumoto, Shiro, Hasegawa, Koichi, Aoki, Toyohiro, Nakamura, Eiji, Hisada, Takashi, Mori, Hiroyuki, Orii, Yasumitsu
Published in Journal of photopolymer science and technology (2016)
Published in Journal of photopolymer science and technology (2016)
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Journal Article
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack
Matsumoto, Keiji, Ibaraki, Soichiro, Sueoka, Kuniaki, Sakuma, Katsuyuki, Kikuchi, Hidekazu, Orii, Yasumitsu, Yamada, Fumiaki
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)
Published in 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2011)
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Conference Proceeding
Solder joint reliability evaluation of chip scale package using a modified Coffin–Manson equation
Shohji, Ikuo, Mori, Hideo, Orii, Yasumitsu
Published in Microelectronics and reliability (01.02.2004)
Published in Microelectronics and reliability (01.02.2004)
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Journal Article
Investigations of cooling solutions for three-dimensional (3D) chip stacks
Matsumoto, Keiji, Ibaraki, Soichiro, Sato, Masaaki, Sakuma, Katsuyuki, Orii, Yasumitsu, Yamada, Fumiaki
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)
Published in 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.02.2010)
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Conference Proceeding
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack, including the transient measurements
Matsumoto, K., Ibaraki, S., Sueoka, K., Sakuma, K., Kikuchi, H., Orii, Y., Yamada, F.
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)
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Conference Proceeding
High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks
Matsumoto, Keiji, Mori, Hiroyuki, Orii, Yasumitsu, Kiritani, Hideki, Kawase, Yasuhiro, Ikemoto, Makoto, Yamazaki, Masanori, Sugiyama, Masaya, Mizutani, Fumikazu
Published in 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2014)
Published in 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2014)
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Conference Proceeding
Combining an Integrated Sensor Array with Machine Learning for the Simultaneous Quantification of Multiple Cations in Aqueous Mixtures
Gabrieli, Gianmarco, Hu, Rui, Matsumoto, Keiji, Temiz, Yuksel, Bissig, Sacha, Cox, Aaron, Heller, Ralph, López, Antonio, Barroso, Jorge, Kaneda, Kitahiro, Orii, Yasumitsu, Ruch, Patrick W
Published in Analytical chemistry (Washington) (21.12.2021)
Published in Analytical chemistry (Washington) (21.12.2021)
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Journal Article
GRAPH PROCESSING DEVICE, GRAPH PROCESSING SYSTEM, AND GRAPH PROCESSING METHOD
HIROSE Shuichi, ORII Yasumitsu, ARIKAWA Kimiko, KANEDA Kitahiro, MORII Shigeki, MORISHITA Natsuki, MITSUMOTO Masataka
Year of Publication 16.02.2023
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Year of Publication 16.02.2023
Patent
INTERCONNECTION STRUCTURE AND INFORMATION PROCESSING DEVICE
AKINAGA, Hiroyuki, SATOU, Dan, ITOH, Toshiyuki, KINOSHITA, Kentaro, SHIMA, Hisashi, NAITOH, Yasuhisa, MATSUO, Takuma, NOKAMI, Toshiki, ORII, Yasumitsu, KOBAYASHI, Masakazu
Year of Publication 07.09.2023
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Year of Publication 07.09.2023
Patent
Thermal stresses of TSV and Si chip in 3D SiP under device operation and reflow process
Sugiura, Tomoya, Kinoshita, Takahiro, Kawakami, Takashi, Matsumoto, Keiji, Kohara, Sayuri, Orii, Yasumitsu
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
Published in 2014 International Conference on Electronics Packaging (ICEP) (01.04.2014)
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Conference Proceeding
Development of vacuum underfill technology for a 3D chip stack
Sakuma, Katsuyuki, Kohara, Sayuri, Sueoka, Kuniaki, Orii, Yasumitsu, Kawakami, Mikio, Asai, Kazuo, Hirayama, Yoshikazu, Knickerbocker, John U
Published in Journal of micromechanics and microengineering (01.03.2011)
Published in Journal of micromechanics and microengineering (01.03.2011)
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Journal Article
SEMICONDUCTOR STRUCTURE INCLUDING THROUGH ELECTRODE, AND METHOD FOR FORMING THE SAME
SUEOKA KUNIAKI, HORIBE AKIHIRO, TORIYAMA KAZUSHIGE, ORII YASUMITSU, MORI HIROYUKI
Year of Publication 04.04.2016
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Year of Publication 04.04.2016
Patent