Thermal, electrical, mechanical analysis and validation of new package TLA developed by UTAC
Kian Yeow Gan, Thammavet, P., Daniel, T. L. T., Ore, S. H., Tamil, J., Hunat, C., Yongbo Yang, Suthiwongsunthorn, N., Laihog, E., Wattanakaroon, W., Sirinorakul, S., Gu Bin, Ang Choon Ghee, Ting Siew Hong
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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