Evaluation of Thermal Crack Propagation in Die-attached Joints Due to Cyclic Energization by Synchrotron Radiation Laminography Monitoring
Ooi, Junya, Mori, Takao, Tsuritani, Hiroyuki, Sayama, Toshihiko, Okamoto, Yoshiyuki, Hoshino, Masato, Uesugi, Kentaro
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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