Improved Thermal Performance of SOI Using a Compound Buried Layer
Baine, Paul, Montgomery, John H., Armstrong, B. Mervyn, Gamble, Harold S., Harrington, Sarah J., Nigrin, Sydney, Wilson, Robin, Oo, Kean B., Armstrong, Alastair G., Suder, Suli
Published in IEEE transactions on electron devices (01.06.2014)
Published in IEEE transactions on electron devices (01.06.2014)
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