Deflashing design rules and its impact towards package quality
Krishnan, Jagen, Ong Luay Kuan
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
ENCAPSULATED PACKAGE WITH EXPOSED ELECTRICALLY CONDUCTIVE STRUCTURES AND SIDEWALL RECESS
LEE, Chai Chee, GOH, Soon Lock, TAN, Chee Voon, LEE, Swee Kah, ONG, Luay Kuan, LEE, Chee Hong
Year of Publication 04.01.2024
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Year of Publication 04.01.2024
Patent