Solder Joint Reliability Performance of Flip Chip Molded Ball Grid Array (BGA) Package for Network/Communication Application
Ong Kang Eu, Too Seong Ling, Loh Wei Keat, Peralta, C., Ong LayLing, Chan Choi Keng, Yap Eng Hooi
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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