High Temperature Oxygen Out-Diffusion from the Interfacial SiOx Bond Layer in Direct Silicon Bonded (DSB) Substrates
Sullivan, J., Kirk, H.R., Sien Kang, Ong, P.J., Henley, F.J.
Published in 2006 IEEE international SOI Conferencee Proceedings (01.10.2006)
Published in 2006 IEEE international SOI Conferencee Proceedings (01.10.2006)
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Conference Proceeding
Plasma-activated bonding, controlled cleave process, and non-contact smoothing for Germanium-on-Insulator (GeOI) manufacturing
Kirk, H.R., Lamm, A., Paler, A., Ong, P.J., Malik, I.J., Kang, S., Henley, F.J.
Published in 2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573) (2004)
Published in 2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573) (2004)
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